Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique

被引：0

作者：

Li, Xuancheng ^{[1
]}

Li, Anran ^{[1
]}

Shi, Hang ^{[1
]}

Yao, Yimin ^{[1
]}

Ye, Zhenqiang ^{[2
]}

Wen, Zhibin ^{[1
]}

Ren, LinLin ^{[1
]}

Zeng, Xiaoliang ^{[1
]}

Xu, Jianbin ^{[3
]}

Han, Meng ^{[1
]}

Sun, Rong ^{[1
]}

机构：

[1] Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China

[2] Shenzhen Univ, Coll Mat Sci & Engn, Shenzhen 518055, Peoples R China

[3] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong 999077, Peoples R China

来源：

MEASUREMENT | 2025年 / 240卷

关键词：

CONDUCTIVITY; PERFORMANCE; CONDUCTANCE;

D O I：

10.1016/j.measurement.2024.115648

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal transport characterization of thermal interface materials (TIMs), especially in their application scenario is so far challenging. Herein, we demonstrate a low- frequency frequency domain thermoreflectance technique to measure the semi-in-situ thermal transport properties of TIMs in a sandwiched structure. The measurement ability is first demonstrated by accurate measurement on several well-known materials. Then the thermal conductivity and interface thermal resistance of a thermal gel, a thermal pad composed of phase change materials and an Indium foil, sandwiched in two silicon slides are investigated. Sensitivity analysis emphasized the importance of pump laser spot size and modulation frequency in the measurement. For TIMs with low thermal conductivity, the sensitivity to interface thermal resistance is highly suppressed, while for TIMs with high thermal conductivity, the sensitivity to interface thermal resistance is prominent, which makes it easier to separately determine the TIM thermal conductivity and interface thermal resistance.

引用

页数：12

共 31 条

[31] CHARACTERIZATION OF METALLICALLY BONDED CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS USING A HIGH ACCURACY 1D STEADY-STATE TECHNIQUE
Wasniewski, Joseph R.
Altman, David H.
Hodson, Stephen L.
Fisher, Timothy S.
Bulusu, Anuradha
Graham, Samuel
Cola, Baratunde A.
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2, 2012, : 231 - +

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