Preparation of Low-Cost and Low-Density Silicone Rubber-Based Thermal Interface Materials by Boron Nitride Oriented Synergistically with Alumina

被引:0
作者
Sun, Jiachen [1 ]
Huang, Fei [1 ]
Yue, Wen [1 ,2 ]
Qin, Wenbo [1 ,3 ]
Shu, Dengfeng [3 ]
Li, Jiansheng [4 ]
Meng, Dezhong [1 ,2 ]
Wang, Chengbiao [1 ,2 ,3 ]
机构
[1] China Univ Geosci Beijing, Sch Engn & Technol, Beijing 100083, Peoples R China
[2] China Univ Geosci Beijing, Zhengzhou Inst, Zhengzhou 451283, Peoples R China
[3] HYMN Adv Mat Technol Shenzhen, Shenzhen 518000, Peoples R China
[4] Anhui Polytech Univ, Anhui Key Lab High Performance Nonferrous Met Mat, Wuhu 241000, Peoples R China
基金
中国国家自然科学基金;
关键词
hexagonal boron nitride; orientation; thermal conduction; thermal interface materials; CONDUCTIVITY ENHANCEMENT; COMPOSITES; NANOCOMPOSITES; FILLERS;
D O I
10.1007/s11665-024-10055-y
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electronic devices such as smart portable devices, drones and electric vehicles are in the process of rapid performance development, which puts higher demands on the thermal conductivity and density of thermal interface materials. These fields hope that under the premise of improving the thermal conductivity of thermal interface materials, the density can be kept unchanged or even reduced, so as to avoid the substantial increase in equipment quality caused by the use of more thermal interface materials. In this context, hexagonal boron nitride was used in conjunction with spherical alumina, and the hexagonal boron nitride was oriented in the through-plane direction through the traditional preparation process of a silicone rubber-based TIMs combined with clever post-processing. When the filling amount of hexagonal boron nitride is 7.2 wt.%, the composite has a through-plane thermal conductivity of 3.257 W m-1 K-1 and a specific gravity of 2.45 which is 86.1% of the traditional thermal interface material (DQL-TP300). At the same time, samples with hexagonal boron nitride oriented exhibited better performance of compression rate, breaking elongation and tensile strength. It provides a feasible solution for preparing the silicone rubber-based thermal interface materials with high thermal conductivity, low density and low cost.
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页数:11
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