Compact Internally Matched High-Power Power Amplifier with a Wide Frequency Band of 0.8-2 GHz

被引:0
作者
Li, Caoyu [1 ]
Zhang, Ziliang [2 ]
Su, Xiang [2 ]
Li, Yue [2 ]
Liang, Xinru [2 ]
Pei, Yi [3 ]
Chen, Changchang [3 ]
Xu, Yuehang [2 ]
机构
[1] Univ Elect Sci & Technol China, Yangtze Delta Reg Inst Huzhou, Huzhou 313001, Peoples R China
[2] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, 2006 Xiyuan Ave,West Hitech Zone, Chengdu 611731, Peoples R China
[3] Dynax Semicond Inc, Suzhou 215300, Peoples R China
关键词
power amplifier; wide-band; high power; internally matched; GAN;
D O I
10.3390/electronics13142687
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, a GaN high-electron-mobility transistor (HEMT) compact high-power wide-band power amplifier with an operation frequency from 0.8 GHz to 2 GHz is proposed. In order to realize a compact design, an internally matched method is employed. A wide-band matching strategy with an LC network and a multi-stage wide-band power combiner/divider is introduced in this design to achieve a wide bandwidth. A power combination structure is applied to have high output power. Wire-spiral inductance and film capacitors are employed to construct the compact matching network. The equivalent inductance of the bonding wire is also involved in the matching network. Experimental results show that the PAE (power-added efficiency) during the whole operation's bandwidth (0.8 GHz to 2.0 GHz) is from 40% to 57%. The output power can reach from 48.3 dBm to 49.8 dBm with a circuit size of 30.8x27.4mm2.
引用
收藏
页数:14
相关论文
共 20 条
  • [1] A Novel Design Approach for Highly Efficient Multioctave Bandwidth GaN Power Amplifiers
    Arnous, Mhd. Tareq
    Zhang, Zihui
    Barbin, Silvio E.
    Boeck, Georg
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 27 (04) : 371 - 373
  • [2] 2 20-GHZ GAAS TRAVELING-WAVE POWER-AMPLIFIER
    AYASLI, Y
    REYNOLDS, LD
    MOZZI, RL
    HANES, LK
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1984, 32 (03) : 290 - 295
  • [3] Multioctave Power Amplifier Design Using 9:1 Planar Impedance Transformer
    Bidgoli, Hossein Asilian
    Khodaei, Meghdad
    Tayarani, Majid
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021, 31 (01) : 45 - 48
  • [4] A Wideband Power Amplifier MMIC Utilizing GaN on SiC HEMT Technology
    Campbell, Charles
    Lee, Cathy
    Williams, Victoria
    Kao, Ming-Yih
    Tserng, Hua-Quen
    Saunier, Paul
    Balisteri, Tony
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2009, 44 (10) : 2640 - 2647
  • [5] Design of Highly Efficient Broadband Class-E Power Amplifier Using Synthesized Low-Pass Matching Networks
    Chen, Kenle
    Peroulis, Dimitrios
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (12) : 3162 - 3173
  • [6] A 1.3-2.08 GHz Filtering Power Divider With Bandwidth Control and High In-Band Isolation
    Chi, Pei-Ling
    Yang, Tao
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (06) : 407 - 409
  • [7] Embar RS, 2020, IEEE MTT S INT MICR, P719, DOI 10.1109/IMS30576.2020.9223833
  • [8] A 0.1-52-GHz Triple Cascode Amplifier With Resistive Feedback
    Hu, Jianquan
    Ma, Kaixue
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2019, 29 (08) : 538 - 540
  • [9] Wafer-Level-Packaged <inline-formula> <tex-math notation="LaTeX">$X$ </tex-math></inline-formula>-Band Internally Matched Power Amplifier Using Silicon Interposer Technology
    Jeong, Junhyung
    Pech, Phanam
    Jeong, Yongchae
    Lee, Sangmin
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2019, 29 (10) : 665 - 668
  • [10] Le QH, 2018, EUR MICROW CONF, P348, DOI 10.23919/EuMC.2018.8541379