A new strategy for preparing high strength and high precision diffusion bonding GH536 joints via pulsed current and subsequent heat treatment

GH536 as a typical solid solution strengthened Ni-based superalloy, has been widely used in the preparation of laminated cooling structure. Diffusion bonding, which is highly promising as a joining process in laminated cooling structure, generally requires high strength and high precision. However, the high strength joint fabricated by the conventional hot pressure diffusion bonding (HPDB) often leads to severe deformation of base materials. Here, we developed a new diffusion bonding strategy to overcome this issue in GH536 via pulsed current diffusion bonding (PCDB) and subsequent heat treatment. At low temperature and short time (900 degrees C/30 min), a joint with a high shear strength of 535 MPa and a low deformation rate of 0.42 % was obtained using the PCDB, and these were 1.60 times and 0.28 times that of the conventional HPDB joint, respectively. Meanwhile, the low bonding temperature and short bonding time hindered the formation and coarsening of carbides, allowing them to be eliminated in a short time heat treatment. The unbonded zones healing, carbide dissolution and recrystallization during heat treatment significantly improved the joint shear strength, and the joint shear strength after heat treatment reached 561 MPa.