Micromachined Silicon Acoustic Delay Lines for High-Frequency Ultrasound Sensing and Imaging

被引:0
作者
Ustun, Arif Kivanc [1 ]
Zou, Jun [2 ]
机构
[1] Tekirdag Namik Kemal Univ, Corlu Fac Engn, Tekirdag, Turkiye
[2] Texas A&M Univ, Dept Elect & Comp Engn, College Stn, TX USA
来源
2024 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, DTIP 2024 | 2024年
关键词
Acoustic delay lines; microfabrication; mechanical stiffness; bulk silicon;
D O I
10.1109/DTIP62575.2024.10613166
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports a new micromachined silicon acoustic delay line (SADL) design for transmitting high-frequency ultrasound signals while adding a certain amount of true time delay. Compared to traditional structures, with the use of a novel thin-film backside linker, the new SADL design can significantly increase the mechanical stiffness of the SADL structure for easy handling and assembly without degrading its acoustic performance. It can be easily scaled up or down to provide different ultrasound frequency response and time delays. For demonstration, high-frequency ultrasound transmission through a multi-channel SADL array has been successfully achieved. The new SADL design could provide a new practical approach for the development of high-frequency ultrasound arrays for high-resolution and high-speed ultrasound sensing & imaging applications.
引用
收藏
页数:5
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