A Review of Electric Impedance Matching Techniques for Piezoelectric Sensors, Actuators and Transducers

被引:108
作者
Rathod, Vivek T. [1 ]
机构
[1] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI 48824 USA
关键词
electric impedance; ultrasonic transducer; matching circuit; broadband sensor; biomedical imaging; nondestructive evaluation; structural health monitoring; acoustic emission; energy harvesting; ULTRASONIC TRANSDUCERS; EQUIVALENT-CIRCUIT; POWER TRANSFER; NONDESTRUCTIVE EVALUATION; ARRAY TRANSDUCER; ENERGY-TRANSFER; FREQUENCY; DESIGN; TRANSMISSION; NETWORK;
D O I
10.3390/electronics8020169
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Any electric transmission lines involving the transfer of power or electric signal requires the matching of electric parameters with the driver, source, cable, or the receiver electronics. Proceeding with the design of electric impedance matching circuit for piezoelectric sensors, actuators, and transducers require careful consideration of the frequencies of operation, transmitter or receiver impedance, power supply or driver impedance and the impedance of the receiver electronics. This paper reviews the techniques available for matching the electric impedance of piezoelectric sensors, actuators, and transducers with their accessories like amplifiers, cables, power supply, receiver electronics and power storage. The techniques related to the design of power supply, preamplifier, cable, matching circuits for electric impedance matching with sensors, actuators, and transducers have been presented. The paper begins with the common tools, models, and material properties used for the design of electric impedance matching. Common analytical and numerical methods used to develop electric impedance matching networks have been reviewed. The role and importance of electrical impedance matching on the overall performance of the transducer system have been emphasized throughout. The paper reviews the common methods and new methods reported for electrical impedance matching for specific applications. The paper concludes with special applications and future perspectives considering the recent advancements in materials and electronics.
引用
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页数:32
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