High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards

被引:0
|
作者
Xu, Wen-Jie [1 ]
Xin, Dong-Jin [1 ,2 ]
Yang, Lei [1 ,2 ]
Zhou, Yong-Kang [1 ]
Wang, Dong [1 ,2 ]
Li, Wei-Xin [1 ,2 ]
机构
[1] Univ Jinan, Sch Informat Sci & Engn, Jinan 250022, Peoples R China
[2] Univ Jinan, Sch Informat Sci & Engn, Shandong Prov Key Lab Ubiquitous Intelligent Comp, Jinan 250022, Peoples R China
关键词
signal integrity (SI); PCB interconnection optimization; resonance; differential VIA hole design; SILICON;
D O I
10.3390/electronics13173377
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub is proposed, with 3D full-wave numerical simulation used for modeling and simulation. Results show that this scheme optimizes the return loss and insertion loss while making the signal eye diagram more ideal, which can improve the transmission effect of high-speed signals.
引用
收藏
页数:11
相关论文
共 50 条
  • [1] Optimization analysis of high-speed differential signal vias in package
    Luo, Jiahu
    Yang, Huan
    Qin, Wenjuan
    Ma, XiaoJian
    Liu, Weidong
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [2] Analysis of via in multilayer printed circuit boards for high-speed digital systems
    Kim, JH
    Han, SW
    Kwon, OK
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 382 - 387
  • [3] High-Speed Printed Circuit Boards: A Tutorial
    Abu Khater, Mohammad
    IEEE CIRCUITS AND SYSTEMS MAGAZINE, 2020, 20 (03) : 34 - 45
  • [4] Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards
    Kim, J
    Lee, H
    Kim, J
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 724 - 735
  • [5] S Parameters Optimization of High-Speed Differential Vias Model on A Multilayer PCB
    Deng, YuYang
    Li, Zhijian
    Yu, Yongtao
    Li, Bin
    Wang, Xiaoqiang
    Wu, Zhaohui
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [6] TRANSIENT ANALYSIS OF A MICROSTRIP DIFFERENTIAL PAIR FOR HIGH-SPEED PRINTED CIRCUIT BOARDS
    Nicolaescu, Mircea
    Croitoru, Victor
    Tuta, Leontin
    REVUE ROUMAINE DES SCIENCES TECHNIQUES-SERIE ELECTROTECHNIQUE ET ENERGETIQUE, 2022, 67 (02): : 167 - 170
  • [7] Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards
    Kim, Jingook
    Rotaru, Mihai D.
    Baek, Seungyong
    Park, Jongbae
    Iyer, Mahadevan K.
    Kim, Joungho
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2006, 48 (02) : 319 - 330
  • [8] Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards
    Wu, Songping
    Fan, Jun
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2012, 54 (02) : 413 - 420
  • [9] Limitations of High-Speed Square Pulses on Printed Circuit Boards
    Sigmund, Milan
    Brancik, Lubomir
    2017 27TH EAEEIE ANNUAL CONFERENCE (EAEEIE), 2017,
  • [10] Optimization of Reflection Issues in High Speed Printed Circuit Boards
    Jagdale, Rohita
    Reddy, A. Venu Gopal
    Sundeep, K.
    RECENT ADVANCES IN NETWORKING, VLSI AND SIGNAL PROCESSING, 2010, : 108 - +