共 50 条
- [1] Optimization analysis of high-speed differential signal vias in package 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [2] Analysis of via in multilayer printed circuit boards for high-speed digital systems ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 382 - 387
- [4] Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 724 - 735
- [5] S Parameters Optimization of High-Speed Differential Vias Model on A Multilayer PCB 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [6] TRANSIENT ANALYSIS OF A MICROSTRIP DIFFERENTIAL PAIR FOR HIGH-SPEED PRINTED CIRCUIT BOARDS REVUE ROUMAINE DES SCIENCES TECHNIQUES-SERIE ELECTROTECHNIQUE ET ENERGETIQUE, 2022, 67 (02): : 167 - 170
- [9] Limitations of High-Speed Square Pulses on Printed Circuit Boards 2017 27TH EAEEIE ANNUAL CONFERENCE (EAEEIE), 2017,
- [10] Optimization of Reflection Issues in High Speed Printed Circuit Boards RECENT ADVANCES IN NETWORKING, VLSI AND SIGNAL PROCESSING, 2010, : 108 - +