Recent Development of Joining Materials, Methods of Reliability Evaluations and Conductive Materials for Electronic Components

This study introduces research trends in the electronics materials, such as joining materials and methods, reliability evaluations and conductive materials by reviewing the special issue published in Materials Transactions (Vol. 63, No. 6) entitled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing-Part III-. In the recent development of bonding materials and reliability evaluation methods for electronic components, in order to improve the bonding reliability bonding materials and bonding methods for not only dissimilar metals but also metals and resins by focusing on elements and processes that have received little attention are proposed. On the other hand, in the fi eld of conductive materials, research that is not limited by conventional methods is being proposed in order to improve the efficiency ffi ciency of heat/electrical / electrical conduction and thermoelectric conversion. [doi:10.2320/matertrans.MT-M2024054] / matertrans.MT-M2024054]