Evaluation of grinding performance and removal mechanism of epoxy resin coated single crystal SiC

被引：1
|
作者：
Sun, Chuan [1 ]
Wei, Chengxiang [2 ]
Qu, Shuoshuo [2 ,3 ]
He, Pengfei [1 ]
Hu, Zhenfeng [1 ]
Liang, Xiubing [1 ]
机构：
[1] Acad Mil Sci, Natl Innovat Inst Def Technol, Beijing 100071, Peoples R China
[2] Shandong Univ, Key Lab High effciency & Clean Mech Manufacture, Minist Educ, Jinan, Peoples R China
[3] Shandong Univ, Shenzhen Res Inst, Shenzhen, Peoples R China
来源：
TRIBOLOGY INTERNATIONAL | 2024年 / 200卷
基金：
中国国家自然科学基金;
关键词：
SiC; Epoxy resin; Precision grinding; Surface quality; BONDED SILICON-CARBIDE; SURFACE;
D O I：
10.1016/j.triboint.2024.110147
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The inherent hardness and brittleness of single crystal silicon carbide (SiC) materials pose challenges in processing high-quality surface products from SiC. To overcome these challenges, an epoxy resin coated grinding method for SiC was developed and employed in this study. The objective was to investigate how the width (d) and thickness (h) of the epoxy resin coating affect the quality of the ground surface. The research indicated that as d increased from 0 to 2.5 mm, the average surface roughness (Ra) of SiC decreased from 57 to 32 nm. Similarly, as h increased from 0 to 0.8 mm, the average Ra decreased from 53 to 31 nm.
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页数：9
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