All-Solution-Processed, All-Organic Flexible Transistor and Circuit Based on Dry-Transfer Polymer Films

Organic thin-film transistors (OTFTs), the key component of the future wearable electronics, have the outstanding advantages including cost-effective, low-temperature, and large-area production. However, all-organic TFTs with an all-solution process and high-precision electrode pattern remain an enormous challenge due to dissolution and incompatible fabricated processes between functional layers. Here, a universal, solution-free transfer and lamination strategy is proposed, which is totally compatible with various commercial materials and fabricated technique in transistors. Excellent mechanical stability, good operation, high-precision electrode patterns, and outstanding conformability are observed in the all-organic TFTs. Moreover, as a proof-of-utility for the strategy, the all-organic complementary inverters are fabricated based on all dry-transfer processes with gain value of 11.2 and stable properties in 30 days in the air. This work provides a universal, solution-free transfer and lamination strategy to fabricate high-precision, all-solution-processed, all-organic devices fully maximizing the great advantages of organic materials for the future multilayered functional, commercialized, and industrialized flexible electronics. This article describes a universal, solution-free transfer, and lamination strategy to fabricate high-precision, all-solution-processed, all-organic electronics. This strategy is compatible with all the materials and fabricated techniques of components in electronics. Combined with different typical semiconductors, an all-organic complementary inverter is fabricated to realize high gain and good stable performance, exhibiting great potential for the future all-organic flexible wearable electronics. image