Guest Editorial for the Special Section on Instrumentation and Measurement for Smart Energy Systems

被引:0
|
作者
Pegoraro, Paolo Attilio [1 ]
Toscani, Sergio [2 ]
Ferrero, Roberto [3 ]
机构
[1] Univ Cagliari, Dept Elect & Elect Engn, I-0913 Cagliari, Italy
[2] Politecn Milan, Dipartimento Elettron Informaz & Bioingn, I-20133 Milan, Italy
[3] Univ Liverpool, Dept Elect Engn & Elect, Liverpool L69 3GJ, England
关键词
D O I
10.1109/OJIM.2022.3226541
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The IEEE Open Journal of Instrumentation and Measurement (OJIM) took its first steps in 2022 and opened a new and exciting venue for contributions on emerging topics from experts in the field. One of the long-standing subjects in the context of instrumentation and measurement is represented by power and energy measurements. In recent decades, this, so to speak, rather traditional field of research has received a new and impressive boost from the evolution of the industrial and economic context, but also from the pressing need to face the environmental problems affecting our Planet, whose mitigation demands a green revolution. Pursuing decarbonization means migrating from fossil fuel toward the intensive exploitation of renewable energy sources. A transition of such a magnitude relies on the ubiquitous presence of electricity and requires the electrification of most of our consumption. All these objectives ask for a new paradigm for energy systems, which shall combine centralized and distributed renewable energy generation, local energy storage, integration with electric mobility, communication, advanced automation, etc.
引用
收藏
页数:3
相关论文
共 50 条
  • [41] Guest Editorial Special Section on Embedded Reconfigurable Computing Systems
    Ferrandi, Fabrizio
    Lysaght, Patrick
    Kastner, Ryan
    IEEE EMBEDDED SYSTEMS LETTERS, 2011, 3 (03) : 75 - 76
  • [42] Guest editorial: Special section on security in distributed computing systems
    Zhao, W
    IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 2003, 14 (09) : 817 - 817
  • [43] Guest Editorial: Introduction to Special Section on Smart Systems and Intelligent Networking Powered With Big Data Analytics
    Li, Ruidong
    Leung, Ka-Cheong
    Nogueira, Michele
    Taleb, Tarik
    Wu, Jie
    IEEE TRANSACTIONS ON NETWORK SCIENCE AND ENGINEERING, 2020, 7 (04): : 2526 - 2527
  • [44] Guest Editorial - Second Special Section of the IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT in the area of VLSI testing - Future of semiconductor test
    Das, SR
    Raisuman, R
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2006, 55 (02) : 378 - 380
  • [45] Guest Editorial Special Issue on the 2010 IEEE International Instrumentation and Measurement Conference
    Yeary, Mark
    Van Moer, Wendy
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2011, 60 (05) : 1503 - 1504
  • [46] Guest Editorial Special Section "Advances in Lightning Modeling, Computation and Measurement"
    Procopio, R.
    Baba, Y.
    Piantini, A.
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2019, 61 (03) : 603 - 605
  • [47] Guest Editorial: Special section on Resilient Control of Cyber-Physical Power and Energy Systems
    Adetola, Veronica
    Edgar, Thomas W.
    Nandanoori, Sai Pushpak
    Zhu, Quanyan
    Abbaszadeh, Masoud
    Rieger, Craig
    IEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY, 2024, 32 (05) : 1688 - 1691
  • [48] Guest Editorial Special Section on Cloud Computing in Smart Grid Operation and Management
    Kishor, N.
    Masoum, M. A. S.
    Nayak, A.
    Srivastava, A.
    IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2018, 14 (03) : 1207 - 1209
  • [49] Guest Editorial: Special Section on Smart Process Manufacturing Driven by Artificial Intelligence
    Qian, F.
    Gao, H.
    Huang, B.
    Bogle, D.
    IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2020, 16 (04) : 2765 - 2766
  • [50] Guest Editorial Special Section on Sustainability
    Patterson, Oliver D.
    Brozek, Tomasz
    Balamukundhan, Kaushik
    Fried, David M.
    Nehrer, Bill
    Ramarajan, Suresh
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2024, 37 (04) : 418 - 421