Effect of Ta/Ni dual-interlayer on the microstructure and properties of high strength titanium alloy and steel composite plate

被引:8
作者
Gao, Xiaowei [1 ,2 ]
Liu, Weifeng [2 ]
Fan, Qunbo [1 ,2 ]
Zhou, Yu [2 ]
Zhou, Sen [3 ]
Tao, Lei [3 ]
Wang, Le [2 ]
Xu, Shun [1 ]
Yang, Lin [1 ]
Zhang, Junjie [1 ]
Yao, Jiahao [2 ]
机构
[1] Beijing Inst Technol, Sch Mat Sci & Engn, Natl Key Lab Sci & Technol Mat Shock & Impact, Beijing 100081, Peoples R China
[2] Beijing Inst Technol, Chongqing Innovat Ctr, Chongqing 401135, Peoples R China
[3] Chongqing Acad Metrol & Qual Inspect, Chongqing 401121, Peoples R China
基金
中国国家自然科学基金;
关键词
Interface; Titanium alloys; Ultra-high strength steel; Laminated composite; STAINLESS-STEEL; MECHANICAL-PROPERTIES; HEAT-TREATMENT; BEHAVIOR;
D O I
10.1016/j.vacuum.2024.113569
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The combination of ultra-high-strength Ti-6Al-4V (TC4) titanium alloy and 30CrNiMoNb (6211) steel was achieved by adding Ta/Ni dual-interlayer and rolling at 950 degrees C through welding a symmetrical blank sleeve with a vacuum electron beam. In order to unveil the metallurgical bonding mechanism and the interfacial structure, SEM, XRD, and compression-shear performance tests were used. The results revealed the presence of thin-film brittle TiC, TiFe, and TiFe2 compounds at the TC4/6211 interface, resulting in an increased risk of interface mismatch and brittle fracture along the matrix phase interface, and the average interfacial bonding strength was tested at 323 MPa. In contrast, the TC4-Ta interface and the 6211-Ni interface in the TC4/Ta/Ni/6211 composite plate displayed good solid solution formation. The strengthening mechanism of the Ta/Ni dual-interlayer interfacial bonding was analyzed using selected area electron diffraction (SAED), revealing that the Ta-Ni diffusion region consisted of Ni3Ta and Ni2Ta. The addition of the Ta/Ni dual-interlayer prevented the aggregation of Ti and Fe atoms to form Ti-Fe compounds. The malleable intermetallic compounds of Ni3Ta and Ni2Ta effectively coordinated deformation, leading to an average interfacial bonding strength of 469 MPa, which was 45.2 % higher than the composite plate without Ta/Ni dual-interlayer.
引用
收藏
页数:12
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