Measurement of thermal contact resistance and the design of thermal contacts at cryogenic temperatures

被引:0
|
作者
Valois, Jared [1 ]
Nellis, Gregory [1 ]
Pfotenhauer, John [1 ]
机构
[1] Univ Wisconsin, Dept Mech Engn, Madison, WI 53706 USA
关键词
Thermal bulk conductivity; Thermal contact resistance; Mechanical contacts; Gold plated; Oxygen Free High Conductivity Copper (OFHC); JOINTS;
D O I
10.1016/j.cryogenics.2024.103922
中图分类号
O414.1 [热力学];
学科分类号
摘要
The prevalence of technologies that operate at cryogenic temperatures requires that the cooling systems used to maintain these systems be carefully designed. This research focuses on understanding the thermal performance of the heat path between the heat source (the technology being cooled) and the cooling source (the cryocooler). Specifically, this work characterizes through measurement the thermal properties of common heat path materials, with a focus on bulk thermal conductivity and thermal contact resistance of pressed contacts. A framework for using these measurements to optimize a bolted contact is proposed and demonstrated.
引用
收藏
页数:14
相关论文
共 50 条
  • [41] Thermal Contact Resistance: Experiment Versus Theory
    L. Dumont
    C. Moyne
    A. Degiovanni
    International Journal of Thermophysics, 1998, 19 : 1681 - 1690
  • [42] Reducing thermal contact resistance using nanocoating
    Goodarzi, Koorosh
    Ramezani, Sayed Reza
    Hajati, Shaaker
    APPLIED THERMAL ENGINEERING, 2014, 70 (01) : 641 - 646
  • [43] EFFECTS OF SURFACE MORPHOLOGY ON THERMAL CONTACT RESISTANCE
    Huang, Haiming
    Xu, Xiaoliang
    THERMAL SCIENCE, 2011, 15 : S33 - S38
  • [44] Modelling of thermal contact resistance within the framework of the thermal lattice Boltzmann method
    Han, K.
    Feng, Y. T.
    Owen, D. R. J.
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2008, 47 (10) : 1276 - 1283
  • [45] The effect of reducing the thermal contact resistance on the performance of battery thermal management system
    Zhang, Wencan
    Ling, Guozhi
    Zhuang, Liangpiao
    Liang, Zhicheng
    INTERNATIONAL JOURNAL OF ENERGY RESEARCH, 2021, 45 (07) : 9970 - 9982
  • [46] Numerical investigation into thermal contact conductance between linear and curvilinear contacts
    Shojaeefard, M. H.
    Aghvami, K. Tafazzoli
    SCIENTIA IRANICA, 2019, 26 (03) : 1293 - 1298
  • [47] Effect of interface morphology on thermal contact resistance in thermal management of electronic devices
    Chen, Yu-Zheng
    Feng, Shi-Wei
    Zhang, Ya-Min
    He, Xin
    Bai, Kun
    Li, Xuan
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2022, 36 (17):
  • [48] Overall Thermal Conductance and Thermal Contact Resistance in No-Insulation REBCO Magnet
    Seok, Jihoon
    Kim, Dongmin
    Kim, Seokho
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2018, 28 (03)
  • [49] Experimental Research on Influence Factors of Thermal Contact Resistance Between Joints
    Zhao, Honglin
    Li, Dianxin
    Huang, Yumei
    Gao, Feng
    Yu, Jia
    Wang, Bo
    Mu, Donghui
    ADVANCES IN MECHANICAL ENGINEERING, PTS 1-3, 2011, 52-54 : 1560 - +
  • [50] Measurement of thermal contact resistance between the mold and the polymer for the stretch-blow molding process
    Bordival, M.
    Schmidt, F. M.
    Le Maoult, Y.
    Coment, E.
    10TH ESAFORM CONFERENCE ON MATERIAL FORMING, PTS A AND B, 2007, 907 : 1245 - +