Electrical and thermal transport properties of Cr2Se3-Cr2Te3 solid-solution alloy system and estimation of optimal thermoelectric properties

Cr2Se3 is a layered narrow-bandgap semiconductor with a low lattice thermal conductivity of similar to 1 W/mK, which can be considered as a potential thermoelectric material. A solid-solution alloy system with Cr2Te3 can be designed to manipulate the electrical and thermal transport properties. In this study, a series of Cr2Se3-Cr2Te3 solid-solution alloys (Cr-2(Se1-xTex)(3), x = 0, 0.33, 0.5, 0.67, 0.83, and 1) were synthesized, and their electrical and thermal transport properties were investigated. Regarding the electrical transport properties, the power factor (similar to 0.35 mW/mK(2)) of Cr2Se3 gradually and significantly decreased as the Te content (x) increased owing to the significant decrease in the Seebeck coefficient that resulted from the large increase in the carrier concentration. Regarding the thermal transport properties, the total thermal conductivity increased with x as a result of the large increase in the electrical conductivity, despite the continuous decrease in the lattice thermal conductivity. Consequently, the thermoelectric figure of merit (zT similar to 0.20) of Cr2Se3 gradually and significantly decreased to 0.009 for Cr2Te3 at 700 K; thus, no enhancement of zT was observed from the experimental results of simple solid-solution alloying. On the other hand, the thermoelectric quality factors of the solid-solution compositions for x = 0.33-0.83 were found to be enhanced compared to that of the Cr2Se3 sample, implying that zT could be further enhanced by optimizing the carrier concentration. Indeed, enhanced zT values were estimated based on a single parabolic band model for the solid-solution compositions with x = 0.33-0.83 if the carrier concentration was optimized to similar to 10(19) cm(-3), which was found to be owing to the increased nondegenerate and weighted mobility (inferring weaker carrier-phonon interaction). Therefore, it is suggested that the solid-solution alloying approach could provide a feasible strategy to enhance the thermoelectric performance by reducing carrier-phonon interaction when further combined with carrier concentration optimization.