Sn nucleation and growth from Sn(II) dissolved in ethylene glycol: Electrochemical behavior and temperature effect

被引:0
|
作者
Van DO, Kiem [1 ]
Van Nguyen, Hieu [1 ,2 ]
Le, Tu Manh [2 ,3 ]
机构
[1] Phenikaa Univ, Fac Elect & Elect Engn, Ha Dong 10000, Hanoi, Vietnam
[2] Phenikaa Res & Technol Inst PRATI, A&A Green Phoenix Grp, 167 Hoang Ngan, Hanoi 10000, Vietnam
[3] Phenikaa Univ, Phenikaa Inst Adv Study PIAS, Fac Mat Sci & Engn, Hanoi 10000, Vietnam
关键词
Sn; nucleation; growth; ethylene glycol; nucleation kinetics; electrodeposition; WATER-CONTENT; IONIC LIQUID; ELECTRODEPOSITION; COATINGS; TIN; COBALT; NANOSTRUCTURES; DEPOSITION; REDUCTION; ADDITIVES;
D O I
10.1016/S1003-6326(24)66571-4
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Thermodynamic and kinetic aspects of Sn nucleation and growth processes onto a glassy carbon electrode from SnCl2<middle dot>2H(2)O dissolved in ethylene glycol solutions were studied. Typical reduction and oxidation peaks observed in voltammograms have demonstrated the capability of ethylene glycol solutions to electrodeposit Sn. The temperature-dependence of diffusion coefficient values derived from potentiodynamic and potentiostatic studies helped to determine and validate estimations of the activation energy for Sn(II) bulk diffusion. Chronoamperometric results have identified that, the suitable model to describe the early stage of Sn electrodeposition could be composed of Sn three-dimensional nucleation and diffusion-controlled growth and water reduction contributions, which was duly validated by theoretical and experimental approaches. From the model, typical kinetic parameters such as the nucleation frequency of Sn (A), number density of Sn nuclei (N0), and diffusion coefficient of Sn(II) ions (D), were determined. The presence of Sn nuclei with excellent quality and their structures were verified using SEM, EDX, and XRD techniques.
引用
收藏
页码:2714 / 2732
页数:19
相关论文
共 50 条
  • [21] Electrochemical behavior of Cu(II), Zn(II), and Sn(II) ions in simultaneous reduction with thiosulfate ions on a molybdenum electrode
    Dergacheva, M. B.
    Urazov, K. A.
    Leont'eva, K. A.
    Khusurova, G. M.
    Gudeleva, N. N.
    Yaskevich, V. I.
    RUSSIAN JOURNAL OF APPLIED CHEMISTRY, 2015, 88 (06) : 1074 - 1077
  • [22] Effect of Sn Micro-alloying on Recrystallization Nucleation and Growth Processes of Ferritic Stainless Steels
    Tong He
    Yang Bai
    Xiuting Liu
    Dan Guo
    Yandong Liu
    Metals and Materials International, 2018, 24 : 789 - 801
  • [23] Effect of Sn Micro-alloying on Recrystallization Nucleation and Growth Processes of Ferritic Stainless Steels
    He, Tong
    Bai, Yang
    Liu, Xiuting
    Guo, Dan
    Liu, Yandong
    METALS AND MATERIALS INTERNATIONAL, 2018, 24 (04) : 789 - 801
  • [24] Electrochemical corrosion evaluation of new Zn-Sn-In coatings electrodeposited in a eutectic mixture containing choline chloride and ethylene glycol
    Pereira, Juliermes C.
    dos Santos, Luis P. M.
    Alcanfor, Ana A. C.
    Campos, Othon S.
    Casciano, Paulo N. S.
    Correia, Adriana N.
    de Lima-Neto, P.
    ELECTROCHIMICA ACTA, 2022, 407
  • [25] Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems
    Baheti, Varun A.
    Kashyap, Sanjay
    Kumar, Praveen
    Chattopadhyay, Kamanio
    Paul, Aloke
    Journal of Alloys and Compounds, 2017, 727 : 832 - 840
  • [26] Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd-Sn and the Pt-Sn systems
    Baheti, Varun A.
    Kumar, Praveen
    Paul, Aloke
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (24) : 18379 - 18386
  • [27] Effect of Alkyltrimethylammonium Ions on Corrosion and Electrochemical Behavior of Pb-Ca-Sn Alloy
    Kopczynski, Kacper
    Gabryelczyk, Agnieszka
    Baraniak, Marek
    Legosz, Bartosz
    Pernak, Juliusz
    Kedzior, Pawel
    Lota, Grzegorz
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2018, 13 (11): : 11058 - 11073
  • [28] Effect of temperature on cyclic deformation behavior of Zr-Sn-Nb alloy
    Sun Chao
    Tan Jun
    Ying Shihao
    Li Cong
    RARE METAL MATERIALS AND ENGINEERING, 2008, 37 (04) : 584 - 588
  • [29] Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
    Guo, Bingfeng
    Kunwar, Anil
    Zhao, Ning
    Chen, Jun
    Wang, Yunpeng
    Ma, Haitao
    MATERIALS RESEARCH BULLETIN, 2018, 99 : 239 - 248
  • [30] Effect of Sn Content on High Temperature Steam Oxidation Behavior of Zr-Sn-0.2Fe-0.1Cr Alloys
    Zha Xuepeng
    Zhao Chenxi
    Xie Yaoping
    Gao Changyuan
    Hu Lijuan
    Yao Meiyi
    RARE METAL MATERIALS AND ENGINEERING, 2023, 52 (03) : 1062 - 1072