Nondestructive testing of chips faults based on Terahertz pulse time-domain reflection technology

被引：0

作者：

Xu, Zhen ^{[1
,2
]}

Ren, Xiang ^{[3
]}

Li, Jining ^{[1
,2
]}

Liu, Longhai ^{[1
,2
]}

Zhang, Nan ^{[3
]}

Luo, Man ^{[1
,2
]}

Jiang, Chen ^{[3
]}

Zhang, Jiaxin ^{[3
]}

Qiao, Xiuming ^{[3
]}

Wang, Tan ^{[3
]}

Xu, Degang ^{[1
,2
]}

机构：

[1] Tianjin Univ, Sch Precis Instruments & Optoelect Engn, Tianjin 300072, Peoples R China

[2] Tianjin Univ, Key Lab Optoelect Informat Technol, Minist Educ, Tianjin 300072, Peoples R China

[3] Aerosp Science& Ind Corp Def Technol R&T Ctr, Beijing 100854, Peoples R China

来源：

PHYSICS LETTERS A | 2024年 / 524卷

基金：

中国国家自然科学基金;

关键词：

Terahertz; Time domain reflection; Integrated chip; Internal fault;

D O I：

10.1016/j.physleta.2024.129838

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

Traditional methods for defect and fault detection in integrated chips have various shortcomings. This study uses terahertz pulse time-domain reflection technology to detect two types of packaged chips with unknown faults and microstrip circuit chips with multiple open circuit faults from different manufacturers. It has achieved qualitative discrimination of internal fault types in packaged chips and precise positioning of fault locations in microstrip circuit wires. When the length of the test line is 27mm, the positioning error is only 1 %. The research results indicate that terahertz pulse time-domain reflection technology has the ability to detect internal faults in integrated chips.

引用

页数：6

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