High Power 190 GHz Frequency Doubler Based On GaAs Schottky Diode

被引:0
作者
Wu, Nan [1 ,2 ]
Jin, Zhi [1 ,2 ]
Zhou, Jingtao [1 ,2 ]
Wei, Haomiao [1 ,2 ,3 ]
Liu, Zhicheng
Lin, Jianming [1 ,2 ]
机构
[1] Chinese Acad Sci, Inst Microelect, High Frequency High Voltage Devices & Integrated C, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
[3] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, Chengdu 611731, Peoples R China
来源
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY | 2024年 / 12卷
关键词
Schottky diodes; Electron devices; Power generation; Power harmonic filters; Frequency conversion; Anodes; Terahertz communications; Thz; frequency doubler; GaAs; high power; DESIGN;
D O I
10.1109/JEDS.2024.3453122
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The research on high power 190 GHz doubler based on the GaAs Schottky diodes is proposed in this paper. The frequency doubler comprises a improved diode configuration that increases the number of anodes by changing the diode arrangement to improve power handling capacity. Electromagnetic and thermal simulation is utilized to demonstrate that the doubler can carry more power. The input power is gradually pumping from 200 mW to 500 mW with an applied DC bias of -15 V. And the peak efficiency of the doubler is measured to be 17%, while the maximum output power is 85 mW at 190 GHz.
引用
收藏
页码:717 / 722
页数:6
相关论文
共 32 条
  • [1] Edholm's law of bandwidth
    不详
    [J]. IEEE SPECTRUM, 2004, 41 (07) : 58 - +
  • [2] Bryerton E, 2019, GLOB SYM MILLIM WAVE, P29, DOI [10.1109/GSMM.2019.8797648, 10.1109/gsmm.2019.8797648]
  • [3] CUTOFF FREQUENCY OF SUBMILLIMETER SCHOTTKY-BARRIER DIODES
    CHAMPLIN, KS
    EISENSTEIN, G
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1978, 26 (01) : 31 - 34
  • [4] A Compact 128-Element Schottky Diode Grid Frequency Doubler Generating 0.25 W of Output Power at 183 GHz
    Dahlback, Robin
    Drakinskiy, Vladimir
    Vukusic, Josip
    Stake, Jan
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 27 (02) : 162 - 164
  • [5] THE HERSCHEL-HETERODYNE INSTRUMENT FOR THE FAR-INFRARED (HIFI)
    de Graauw, Th.
    Whyborn, N.
    Caux, E.
    Phillips, T.
    Stutzki, J.
    Tielens, A.
    Guesten, R.
    Helmich, F.
    Luinge, W.
    Martin-Pintado, J.
    Pearson, J.
    Planesas, P.
    Roelfsema, P.
    Saraceno, P.
    Schieder, R.
    Wildeman, K.
    Wafelbakker, K.
    [J]. ASTRONOMY IN THE SUBMILLIMETER AND FAR INFRARED DOMAINS WITH THE HERSCHEL SPACE OBSERVATORY, 2009, 34 : 3 - +
  • [6] Thermal Characterization of THz Schottky Diodes Using Transient Current Measurements
    Khanal, Subash
    Kiuru, Tero
    Tang, Aik-Yean
    Saber, Mohammad Arif
    Mallat, Juha
    Stake, Jan
    Narhi, Tapani
    Raisanen, Antti V.
    [J]. IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2014, 4 (02) : 267 - 276
  • [7] A Wafer-Level Diamond Bonding Process to Improve Power Handling Capability of Submillimeter-Wave Schottky Diode Frequency Multipliers
    Lee, C.
    Ward, J.
    Lin, R.
    Schlecht, E.
    Chattopadhyay, G.
    Gill, J.
    Thomas, B.
    Maestrini, A.
    Mehdi, I.
    Siegel, P.
    [J]. 2009 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-3, 2009, : 957 - +
  • [8] A 540-640-GHz high-efficiency four-anode frequency tripler
    Maestrini, A
    Ward, JS
    Gill, JJ
    Javadi, HS
    Schlecht, E
    Tripon-Canseliet, C
    Chattopadhyay, G
    Mehdi, I
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2005, 53 (09) : 2835 - 2843
  • [9] A 1.7-1.9 THz local oscillator source
    Maestrini, A
    Ward, J
    Gill, J
    Javadi, H
    Schlecht, E
    Chattopadhyay, G
    Maiwald, F
    Erickson, NR
    Mehdi, I
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2004, 14 (06) : 253 - 255
  • [10] In-phase power-combined frequency triplers at 300 GHz
    Maestrini, Alain
    Ward, John S.
    Tripon-Canseliet, Charlotte
    Gill, John J.
    Lee, Choonsup
    Javadi, Hamid
    Attopadhyay, Goutam Ch.
    Mehdi, Imran
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2008, 18 (03) : 218 - 220