Effect of wire diameter compression ratio on drawing deformation of micro copper wire

被引:0
作者
Huang, Tao [1 ]
Wu, Han-jiang [1 ]
Song, Ke-xing [1 ,2 ]
Zhang, Yan-min [1 ]
Zhou, Yan-jun [1 ]
Li, Shao-lin [1 ]
机构
[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Luoyang 471023, Peoples R China
[2] Henan Acad Sci, Inst Mat, Henan Key Lab Adv Cond Mat, Zhengzhou 450000, Peoples R China
基金
中国国家自然科学基金;
关键词
micro copper wire; drawing deformation; crystal plasticity; finite element; slip mode; SHAPE-MEMORY ALLOY; CRYSTAL PLASTICITY; TEXTURE EVOLUTION; BEHAVIOR; HETEROGENEITY; SIMULATION; SIZE; FOIL;
D O I
10.1016/S1003-6326(24)66563-5
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire, based on rate-dependent crystal plasticity theory. The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated. Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed, forming distinct slip and non-slip zones. Additionally, horizontal strain concentration bands develop within the drawn wire. As the wire diameter compression ratio increases, the strength of the slip systems and the extent of slip zones inside the deformation zone also increase. However, the fluctuating stress state, induced by contact pressure and frictional stress, results in a rough and uneven wire surface and diminishes the stability of the drawing process.
引用
收藏
页码:2605 / 2618
页数:14
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