Self-healing, low oil leakage and recyclable thermally conductive Al2O3/boron nitride@siloxane composites based on reversible dynamic network

被引:4
作者
Tu, Zhiting [1 ]
Wu, Weijian [1 ]
Hao, Zhifeng [1 ]
Chen, Xiang [1 ]
Chen, Qiuling [1 ]
Huang, Xiaonan [1 ]
Selim, Mohamed S. [1 ,2 ]
Yu, Jian [1 ]
机构
[1] Guangdong Univ Technol, Sch Chem Engn & Light Ind, Guangdong Prov Key Lab Plant Resources Biorefinery, Guangzhou 510006, Peoples R China
[2] Egyptian Petr Res Inst EPRI, Petr Applicat Dept, Nasr City, Egypt
基金
中国国家自然科学基金;
关键词
polydimethylsiloxane; recyclable; self-healing; thermal conductivity; PERFORMANCE; FILLER;
D O I
10.1002/app.56094
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In order to overcome the commercialized silicone-based thermal interface materials' issues such as oil leakage and mechanical damage, we developed a thermoset silicone rubber matrix (SR) achieved through the condensation reaction of hydroxyl silicone oil and tetraethyl silicate. Additionally, we constructed a self-healing and recyclable silicone rubber matrix (SCNR) by incorporating heat reversible ionic and hydrogen bonds between carboxyl and amino functionalized polydimethylsiloxane. Finally, the flexible, low oil leakage, self-healing, and recyclable composites Al2O3/BN@SR/SCNR was prepared by adjusting the ratio of SR/SCNR and the spherical alumina and boron nitride (BN) fillers. The results indicated that with SR/SCNR mass ratio of 1/0.075 and filler content of 70 wt%, the thermal conductivity of the composite reaches 1.866 W m(-1) K-1, 646% increasing over the SR/SCNR matrix. The self-healing efficiency reaches 97% and the thermal conductivity remains essentially unchanged after being recycled for three times. The composites can be bent and twisted multiple times and still return to their original shape. Notably, the oil leakage of the Al2O3/BN@SR/SCNR composites is significantly lower than that of additive silicone composites. Therefore, the recyclable thermal conductivity composite developed in this study provides a promising solution for improving the durability of heat dissipation materials in electronic devices.
引用
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页数:19
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