Effect of substrate temperature on the structural properties of Tungsten Carbide and Tungsten-rich Tungsten Carbide films

The unique mechanical properties of Tungsten Carbide (WC), such as fracture toughness, exceptional hardness, high melting temperature, outstanding thermal stability, anti-oxidation qualities fatigue and creep resistance, have made it a suitable industrial material for different applications. It is also considered to be a promising material for coating on plasma-facing walls in a Tokamak reactor. The aim of the present work is to study the effect of varying substrate temperature, concentration of tungsten (W) and annealing in the structural properties of WC films. The WC films are deposited on a silicon substrate at different substrate temperatures viz. RT (300 K), 400, 500, 600 and 700 K using DC magnetron sputtering. W-rich WC films were deposited keeping the power of WC constant (100 Watt) and varying W powers (10 Watt, 20 Watt, 30 Watt, 40 Watt) at room temperature. Later, these W-rich WC films were annealed at 800 degrees C in a reducing atmosphere. Glancing incidence X-ray diffraction (GIXRD) and Raman spectroscopy of the films are performed for structural analysis. GIXRD of the WC films reveals that as-deposited RT films are amorphous. However, films which are either deposited at elevated substrate temperature or are annealed are crystalline. This is confirmed by Raman's measurements. It also indicates the presence of disorder and nanocrystalline phases due to temperature variations.