IGBT Junction Temperature Extraction via Voltage Integral Over Voltage Rise Period

In this article, a temperature-sensitive electrical parameter (TSEP) method for insulated gate bipolar transistor (IGBT) module junction temperature estimation based on voltage integral over voltage rise period (VIVRP) is proposed. First, combined with the principles of thermodynamic physics, the movement characteristics of internal carriers and holes are discussed, and the waveform of voltage and current during the turn-off process is studied. The feasibility of using voltage integral overvoltage period instead of voltage rise loss in junction temperature measurement is discussed and proved. At the beginning of the turn-off process, the holes in the IGBT almost remain in spatial and temporal distribution (the collector current IC remains constant), which leads the VIVRP to a cheaper TSEP method for junction temperature detection, without the high-frequency current detection equipment. Finally, the junction temperature model based on VIVRP and the extraction circuit of VIVRP are proposed. In addition, it is compared with the junction temperature detection method based on the voltage rise time and voltage rise loss. The results show that the junction temperature detection method based on VIVRP proposed in this article is detection with high precision and low cost.