Online Monitoring Method for Junction Temperature of SiC MOSFETs based on Temperature Sensitive Electrical Parameter

被引:2
作者
Cao, Han [1 ]
Ning, Puqi [2 ,3 ,4 ,5 ]
Huang, Yunhao [2 ,3 ,4 ,5 ]
Wen, Xuhui [2 ,3 ,4 ,5 ]
机构
[1] Wuhan Second Ship Design & Res Inst, Wuhan 430205, Peoples R China
[2] Chinese Acad Sci, Inst Elect Engn, Key Lab Power Elect & Elect Drive, Beijing 100190, Peoples R China
[3] Chinese Acad Sci, Inst Elect Engn, Beijing 100190, Peoples R China
[4] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
[5] Collaborat Innovat Ctr Elect Vehicles Beijing, Beijing 100081, Peoples R China
基金
国家重点研发计划;
关键词
Temperature measurement; Temperature sensors; Semiconductor device measurement; Junctions; Voltage measurement; Monitoring; MOSFET; Junction temperature; Silicon Carbide (SiC) MOSFET; TSEP; RELIABILITY;
D O I
10.17775/CSEEJPES.2021.04840
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Compared to Si devices, the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material. This paper proposes a practical SiC MOSFET junction temperature monitoring method based on the on-state voltage $\boldsymbol{V}_{\mathbf{ds}(\mathbf{on})}$ measurement. In Section II of the paper, the temperature sensitivity of the on-state voltage $\boldsymbol{V}_{\mathbf{ds}(\mathbf{on})}$ is characterized. The hardware of the measurement system is set up in Section III, which consists of an On-state Voltage Measurement Circuit (OVMC), the sampling and isolation circuit. Next, a calibration method based on the self-heating of the SiC MOSFET chip is presented in Section IV. In the final Section, the junction temperature is monitored synchronously according to the calibration results. The proposed method is applied to a Buck converter and verified by both an Infrared Radiation (IR) camera and a Finite Element Analysis (FEA) tool.
引用
收藏
页码:1799 / 1807
页数:9
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