Avoiding dust contamination by near-plasma chemical surface engineering

被引:1
|
作者
Hegemann, Dirk [1 ]
Gora, Michal [1 ,2 ]
Kalemi, Flaela [1 ]
Navascues, Paula [1 ]
机构
[1] Empa, Swiss Fed Labs Mat Sci & Technol, Lab Adv Fibers, Plasma & Coating Grp, St Gallen, Switzerland
[2] Swiss Fed Inst Technol, Dept Mat, CH-8092 Zurich, Switzerland
来源
MATERIALS TODAY NANO | 2024年 / 27卷
基金
瑞士国家科学基金会;
关键词
Plasma polymerization; Powder formation; Dust contamination; Thin films; PECVD; DISCHARGE; PARTICLES;
D O I
10.1016/j.mtnano.2024.100503
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Dust contamination is a frequent problem when processing materials at the nanoscale by plasma technology. Various approaches have thus been applied to protect samples, however, requiring to adjust plasma properties which also imposes limitations on the process window. We therefore propose near-plasma chemical (NPC) surface engineering as a way to avoid dust contamination during and after plasma operation without altering the plasma environment by simply locating a polymeric mesh above the samples in the plasma sheath. Because of the electric potential acquired by the mesh, heavy charged particles cannot pass the open area of the mesh, avoiding their contact with the samples positioned below. Samples fabricated by NPC surface engineering are dust-free independently on the size or the origin of the powder nanoparticles. This neat approach can support many high-precision, dust-free applications of plasma technology on an industrial scale.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] The influence of dust aerosols on solar radiation and near-surface temperature during a severe duststorm transport episode
    Huang, Guan
    Zhou, Yaman
    Guo, Zijia
    Liu, Xin
    Chen, Yonghang
    Liu, Qiong
    Ta, Zhijie
    Wang, Pengtao
    He, Qing
    Gao, Jiacheng
    Zhang, Ying
    FRONTIERS IN ENVIRONMENTAL SCIENCE, 2023, 11
  • [32] GaN film fabrication by near-atmospheric plasma-assisted chemical vapor deposition
    Nagata, Takahiro
    Sakuma, Yoshiki
    Uehara, Tsuyoshi
    Chikyow, Toyohiro
    Japanese Journal of Applied Physics, Part 2: Letters, 2007, 46 (1-3):
  • [33] Surface and Chemical Characterization of PolyLA Thin Films Fabricated Using Plasma Polymerization
    Easton, Christopher D.
    Jacob, Mohan V.
    Shanks, Robert A.
    Bowden, Bruce F.
    CHEMICAL VAPOR DEPOSITION, 2009, 15 (7-9) : 179 - 185
  • [34] Surface characterisation of carbon films produced by plasma chemical vapour deposition method
    Khettache, A.
    Staedler, T.
    Touhami, M. Z.
    Weiss, H.
    Jiang, X.
    SURFACE ENGINEERING, 2013, 29 (06) : 474 - 478
  • [35] Plasma-assisted surface chemical patterning for single-cell culture
    Cheng, Qian
    Li, Song
    Komvopoulos, Kyriakos
    BIOMATERIALS, 2009, 30 (25) : 4203 - 4210
  • [36] Plasma-aerosol-assisted surface engineering for scalable oil/water membrane separation
    Ma, Chuanlong
    Nikiforov, Anton
    Gromov, Mikhail
    Ostrikov, Kostya
    De Geyter, Nathalie
    Morent, Rino
    APPLIED SURFACE SCIENCE, 2022, 606
  • [37] Highly efficient grafting of silazanes to the inner surface of the vials under mild conditions by surface engineering to improve the chemical durability
    Zhou, Ruolin
    Tan, Shengyao
    Xie, Fangrui
    Dong, Jing
    Zhu, Jianping
    Fang, Linxuan
    Wu, Lianbin
    APPLIED SURFACE SCIENCE, 2025, 697
  • [38] Surface Nitridation of c-Plane Sapphire Substrate by Near-Atmospheric Nitrogen Plasma
    Nagata, Takahiro
    Haemori, Masamitsu
    Anzai, Junichiro
    Uehara, Tsuyoshi
    Chikyow, Toyohiro
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2009, 48 (04)
  • [39] Concentration level and surface chemical composition of urban airborne particles near crossroads in Zabrze, Poland
    Rogula, Wioletta
    Pastuszka, Jozef S.
    Talik, Ewa
    ARCHIVES OF ENVIRONMENTAL PROTECTION, 2007, 33 (02) : 23 - 34
  • [40] Photoluminescent Si/SiOx nanoparticle network by near atmospheric plasma-enhanced chemical vapour deposition
    Yang, Q. Y.
    Wang, D. X.
    Guo, Y.
    Ding, K.
    Xu, J. Z.
    Shi, J. J.
    Zhang, J.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2011, 44 (44)