Plasma-enhanced atomic layer deposition of silicon nitride thin films with different substrate biasing using Diiodosilane precursor

In this work, we report on Plasma-Enhanced Atomic Layer Deposition (PE-ALD) of SiNx films using Diiodosilane (DIS) precursor and N2-H2 plasma. Systematic studies as a function of DIS dosing time, plasma duration, plasma composition and deposition temperature are investigated. The material properties have been studied using X-ray photoelectron spectroscopy (XPS), X-Ray Reflectometry (XRR), Atomic Force Microscopy (AFM) and HighResolution Transmission Electron Microscopy (HR-TEM). The optimal deposition parameters for achieving high-quality SiNx with a high growth per cycle (GPC) are first determined. We show that DIS offers a wide temperature window for SiNx deposition starting from 110 degrees C up to 300 degrees C, paving the way for a large choice of SiN-based applications. The impact of substrate biasing on SiNx film deposition and properties is also investigated. We show that high ion energies during the nitridation step can cause surface damage and void formation, thus affecting the SiNx quality. Overall, these results highlight the importance of this novel precursor for growing SiNx using PE-ALD and the possible swapping of the material properties by fine control of the substrate biasing, which can help to go far beyond the existing SiNx limitations.