共 52 条
Dynamic position optimization of submerged array square jet cooling in confined space for chip thermal dissipation
被引:1
作者:

Bao, Yunhao
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机构:
Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China

Chen, Jianye
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h-index: 0
机构:
Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China

Shao, Shuangquan
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h-index: 0
机构:
Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China
机构:
[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430064, Peoples R China
关键词:
Jet cooling plate;
Dynamic position optimization;
Maximum temperature;
Temperature dispersion;
NUMERICAL-SIMULATION;
IMPINGEMENT;
THERMOSIPHON;
PERFORMANCE;
SYSTEM;
D O I:
10.1016/j.ijthermalsci.2024.109306
中图分类号:
O414.1 [热力学];
学科分类号:
摘要:
Jet position has a significant influence on the heat transfer characteristics of the chip. Therefore, it is necessary to optimize the jet position to improve its operating performance. Besides, traditional and typical optimization method is to establish abundant experimental/numerical models, which is very complicated and timeconsuming, and the accuracy and effectiveness of results still need to be verified. Hence, a dynamic optimization method is proposed in this study and the jet position is directly controlled during the simulation process based on dynamic regulation of user-defined functions, which is directly related to the real-time physical quantities and the user-defined optimization strategy. Results show that compared to traditional jet position, the maximum temperature and temperature dispersion for the optimal jet position decrease by an average of 25.20 degrees C and 69.88 %, respectively. Furthermore, the optimal jet position efficiently achieves the balance between thermal performance and power consumption. To sum up, compared with manual optimization method, the dynamic optimization method proposed in this study only needs to establish one model and simulate it once to obtain the optimized result. This process is very convenient, high-efficiency and less time-consuming, which will be especially beneficial to effectively enhance the performance of the chip thermal dissipation.
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页数:14
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