Inhibition of intermetallic compounds using pure Ni or Ni-Al2O3 nanocomposite coating during the ultrasonic-assisted soldering of Mg/Al dissimilar metals

被引:6
作者
Liu, Yingzong [1 ]
Li, Yuanxing [1 ]
Cui, Jinzhe [1 ]
Zhu, Zongtao [1 ]
Chen, Hui [1 ]
机构
[1] Southwest Jiaotong Univ, Sch Mat Sci & Engn, Key Lab Adv Technol Mat, Minist Educ, Chengdu 610031, Peoples R China
基金
中国国家自然科学基金;
关键词
Ultrasonic-assisted soldering; Pure Ni or Ni-Al2O3 composite coating; Mg2Sn compound; Shear strength; AL/MG; MG; MICROSTRUCTURE; STRENGTH; ALLOYS; JOINT; MG2SN; ZN; SN;
D O I
10.1016/j.jmatprotec.2024.118417
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The widespread utilization of lightweight Mg and Al alloys underscores the importance of establishing reliable connections between them. However, joining dissimilar Mg/Al alloys presents challenges, primarily due to uncontrolled formation of intermetallic compounds during the process, leading to weakened joint performance. To inhibit its formation, a Ni or Ni-Al2O3 nanocomposite coating served as a barrier layer during ultrasonic-assisted soldering AZ31 Mg/6061 Al using Sn-3.0Ag-0.5Cu solder. By investigating the impacts of Ni/Ni-Al2O3 composite coating on microstructure, intermetallic compounds formation, and joint performance, we found that the Ni coating partially inhibited Mg diffusion into the solder at 260 degrees C for 20 min, thus limiting excessive Mg2Sn compound formation and increasing shear strength by approximately 110% compared to uncoated joints. However, with an extension of the holding time to 30 min, block-shaped Mg2Sn compound reemerged as the primary cause of joint failure. Using Ni-Al2O3 composite coating further broadened the process window of Mg/Al soldering, eliminating block-shaped Mg2Sn compound in the joint at 260 degrees C for 40 min. The incorporation of Al2O3 further enhanced joint properties, with the maximum shear strength of the Mg(Ni-Al2O3)/SAC/Al joint reaching approximately 66.6 MPa, an improvement of 18.3% compared to the joint with Ni coating. This enhancement shifted the fracture position from the Ni/SAC interface to the SAC solder. Additionally, due to grain refinement in the Ni matrix, the microhardness of the Ni-Al2O3 composite coating surpassed that of the Ni coating. A model of Ni/Ni-Al2O3 composite coating preventing intermetallic compounds formation of was proposed. This nanocomposite coating-ultrasonic assisted soldering method effectively avoids the issue of excessive intermetallic compounds formation when joining dissimilar metals.
引用
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页数:13
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