Ultrasonic vibration-induced amorphization in the Cu-Al interface

被引：1

作者：

Cheng, X. M. ^{[1
,2
]}

Yang, K. ^{[1
]}

Wu, Y. F. ^{[1
,2
]}

Wang, J. ^{[1
,2
]}

Zhao, J. H. ^{[1
]}

机构：

[1] Hohai Univ, Coll Mat Sci & Engn, Changzhou 213022, Peoples R China

[2] Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Peoples R China

来源：

MATERIALS LETTERS | 2024年 / 377卷

关键词：

Amorphous; Structural; Ultrasonic welding; Copper; Aluminum; PRESSURE;

D O I：

10.1016/j.matlet.2024.137442

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A similar to 40 nm thick nanocrystal-amorphous mixed zone was found at the Cu/Al interface induced by ultrasonic welding. It is believed that the formation of amorphous Cu/Al alloys is attributed to the local free energy increase and shear stresses during ultrasonic vibration. The lowering of the amorphization barrier is a prerequisite for ultrasonic vibration-induced interfacial amorphization, which is in intrinsic contrast to previously reported dislocation-mediated amorphization.

引用

页数：5

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