Extending Electrostatic Modeling for Schottky p-GaN Gate HEMTs: Uniform and Engineered p-GaN Doping

被引:0
|
作者
Alaei, Mojtaba [1 ,2 ]
Borga, Matteo [3 ]
Fabris, Elena [3 ]
Decoutere, Stefaan [3 ]
Lauwaert, Johan [4 ]
Bakeroot, Benoit [1 ,2 ]
机构
[1] Univ Ghent, Ctr Microsyst Technol CMST, B-9052 Ghent, Belgium
[2] Univ Ghent, Interuniv Microelect Ctr IMEC, B-9052 Ghent, Belgium
[3] Interuniv Microelect Ctr IMEC, B-3001 Leuven, Belgium
[4] Univ Ghent, Liquid Crystals & Photon Grp LCP, B-9052 Ghent, Belgium
关键词
MODFETs; HEMTs; Logic gates; Mathematical models; Wide band gap semiconductors; Aluminum gallium nitride; Semiconductor process modeling; Barrier voltage; breakdown; forward bias gate leakage current; junction voltage; p-GaN doping engineering; p-GaN gate HEMTs; uniform p-GaN doping; AVALANCHE BREAKDOWN VOLTAGE; THRESHOLD VOLTAGE; DENSITY;
D O I
10.1109/TED.2024.3446488
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article presents a comprehensive analytical framework for modeling p-GaN gate high-electron-mobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrodinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction (Delta V-j), and AlGaN barrier ( Delta V-b) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AlGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.
引用
收藏
页码:5949 / 5955
页数:7
相关论文
共 50 条
  • [41] p-GaN Gate HEMTs With 10.6 V Maximum Gate Drive Voltages by Mg Doping Engineering
    Zhou, Guangnan
    Zeng, Fanming
    Gao, Rongyu
    Wang, Qing
    Cheng, Kai
    Li, Lingqi
    Xiang, Peng
    Du, Fangzhou
    Xia, Guangrui
    Yu, Hongyu
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (05) : 2282 - 2286
  • [42] GaN HEMTs with p-GaN gate: field- and time-dependent degradation
    Meneghesso, G.
    Meneghini, M.
    Rossetto, I.
    Canato, E.
    Bartholomeus, J.
    De Santi, C.
    Trivellin, N.
    Zanoni, E.
    GALLIUM NITRIDE MATERIALS AND DEVICES XII, 2017, 10104
  • [43] Gate-geometry dependence of electrical characteristics of p-GaN gate HEMTs
    Lee, Ethan S.
    Joh, Jungwoo
    Lee, Dong Seup
    del Alamo, Jesus A.
    APPLIED PHYSICS LETTERS, 2022, 120 (08)
  • [44] Influence of Mg doping level at the initial growth stage on the gate reliability of p-GaN gate HEMTs
    Guo, Yijin
    Wang, Haodong
    Chen, Xin
    Gao, Hongwei
    Li, Fangqing
    Zhong, Yaozong
    Zhou, Yu
    Li, Qian
    Li, Wenbo
    Sun, Qian
    Yang, Hui
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2022, 55 (35)
  • [45] Gate reliability enhancement of p-GaN gate HEMTs with oxygen compensation technique
    Wang, Chengcai
    Chen, Junting
    Jiang, Zuoheng
    Chen, Haohao
    APPLIED PHYSICS EXPRESS, 2024, 17 (05)
  • [46] Review of technology for normally-off HEMTs with p-GaN gate
    Greco, Giuseppe
    Iucolano, Ferdinando
    Roccaforte, Fabrizio
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 78 : 96 - 106
  • [47] Thermionic Field Emission in the Lifetime Estimation of p-GaN Gate HEMTs
    Greco, G.
    Fiorenza, P.
    Giannazzo, F.
    Vivona, M.
    Venuto, C.
    Iucolano, F.
    Roccaforte, F.
    IEEE ELECTRON DEVICE LETTERS, 2024, 45 (10) : 1724 - 1727
  • [48] High-performance Reverse Blocking p-GaN HEMTs with Multi-column p-GaN/Schottky Alternate-island Drain
    Sun, Ruize
    Wang, Fangzhou
    Luo, Pan
    Xu, Wenjun
    Wang, Yang
    Liu, Chao
    Chen, Wanjun
    Zhang, Bo
    2022 IEEE 34TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2022, : 173 - 176
  • [49] The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs
    Millesimo, M.
    Borga, M.
    Bakeroot, B.
    Posthuma, N.
    Decoutere, S.
    Sangiorgi, E.
    Fiegna, C.
    Tallarico, A. N.
    IEEE ELECTRON DEVICE LETTERS, 2022, 43 (11) : 1846 - 1849
  • [50] Gate Current in p-GaN Gate HEMTs as a Channel Temperature Sensitive Parameter: A Comparative Study between Schottky- and Ohmic-Gate GaN HEMTs
    Borghese, Alessandro
    Di Costanzo, Alessandro
    Riccio, Michele
    Maresca, Luca
    Breglio, Giovanni
    Irace, Andrea
    ENERGIES, 2021, 14 (23)