ScAlMgO4 (SCAM), which can be used as an epitaxial substrate material of GaN in power devices, faces the challenge of achieving a high-quality surface by ultra-precision polishing due to its brittle and easily cleaved characteristics, which are closely associated with its mechanical properties. The micromechanical properties of SCAM single crystals were evaluated by nanoindentation and microscratch tests using different indenters. The elastic modulus E-IT and the indentation hardness H-IT of SCAM obtained by nanoindentation were 226 GPa and 12.1 GPa, respectively. Leaf-shaped chips and the associated step-like planes of SCAM can be found in the severely damaged regime during scratching by Berkovich and Vickers indenters with sharp edges due to the intersection of intense radial and lateral cracks. The fracture toughness (K-c = 1.12 MPa<middle dot>m(1/2)) of SCAM can be obtained by using a scratch-based methodology for a spherical indenter based on linear elastic fracture mechanics (LEFM) under an appropriate range of applied loads. An optimal expression for calculating the fracture toughness of easily cleaved materials, including SCAM, via the Vickers indenter-induced cracking method using a Berkovich indenter was recommended.
机构:
Hong Kong Polytech Univ, State Key Lab Ultraprecis Machining Technol, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, State Key Lab Ultraprecis Machining Technol, Kowloon, Hong Kong, Peoples R China
Lee, W. B.
Chen, Y. P.
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Hong Kong Polytech Univ, State Key Lab Ultraprecis Machining Technol, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, State Key Lab Ultraprecis Machining Technol, Kowloon, Hong Kong, Peoples R China
机构:
Noorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, IndiaNoorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
Jebin, R. P.
Suthan, T.
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Noorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
Lekshmipuram Coll Arts & Sci, Lekshmipuram 629802, Tamil Nadu, IndiaNoorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
Suthan, T.
Rajesh, N. P.
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SSN Coll Engn, Dept Phys, Kalavakkam 603110, IndiaNoorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
Rajesh, N. P.
Vinitha, G.
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VIT, Div Phys, Madras 600175, Tamil Nadu, IndiaNoorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
Vinitha, G.
Madhusoodhanan, U.
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Indira Gandhi Ctr Atom Res, Radiol Safety Div, Kalpakkam 603102, Tamil Nadu, IndiaNoorul Islam Ctr Higher Educ, Dept Phys, Kumaracoil 629180, India
机构:
Univ Silesia, Inst Mat Sci, Chorzow, PolandAGH Univ Sci & Technol, Fac Met Engn & Ind Comp Sci, A Mickiewicza Ave 30, PL-30059 Krakow, Poland
Zubko, M.
Kalemba-Rec, I.
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AGH Univ Sci & Technol, Fac Met Engn & Ind Comp Sci, A Mickiewicza Ave 30, PL-30059 Krakow, PolandAGH Univ Sci & Technol, Fac Met Engn & Ind Comp Sci, A Mickiewicza Ave 30, PL-30059 Krakow, Poland
Kalemba-Rec, I.
Berent, K.
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AGH Univ Sci & Technol, Acad Ctr Mat & Nanotechnol, Krakow, PolandAGH Univ Sci & Technol, Fac Met Engn & Ind Comp Sci, A Mickiewicza Ave 30, PL-30059 Krakow, Poland
机构:
Inst Technol Res State Sao Paulo IPT, Ctr Met & Mat Technol, Sao Paulo, SP, Brazil
Univ Sao Paulo, Polytech Sch, Dept Met & Mat Engn, Sao Paulo, SP, BrazilInst Technol Res State Sao Paulo IPT, Ctr Met & Mat Technol, Sao Paulo, SP, Brazil
Moreira, M. F.
Fantin, L. B.
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Inst Technol Res State Sao Paulo IPT, Ctr Met & Mat Technol, Sao Paulo, SP, Brazil
Univ Sao Paulo, Polytech Sch, Dept Met & Mat Engn, Sao Paulo, SP, BrazilInst Technol Res State Sao Paulo IPT, Ctr Met & Mat Technol, Sao Paulo, SP, Brazil
Fantin, L. B.
Azevedo, C. R. F.
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Univ Sao Paulo, Polytech Sch, Dept Met & Mat Engn, Sao Paulo, SP, BrazilInst Technol Res State Sao Paulo IPT, Ctr Met & Mat Technol, Sao Paulo, SP, Brazil