Microstructure characteristics for improved thermal shock reliability of sintered Ag-Al - Al paste in SiC power module

To meet the harsh thermal shock (- 50-250 - 250 degrees C) requirements of power device packaging, a novel sintered Ag-based die attach material based on the sustained release effect of Al was proposed. In this study, Al particles with natural core-shell structure covered with Al2O3 layer were selected as the ideal doping-phase, and micron Al particles doped sintered Ag composite paste (AgAl) was prepared. First, the microstructural evolution of sintered AgAl joints during thermal shock was studied. The results showed that Al particles effectively suppressed the cracks generation, which attributed to the sustained release effect of Al element. To clarify sustained release mechanism of Al, the interfaces evolution between Ag and Al particles was investigated. In the initial stage, Al was covered by the Al2O3 layer, preventing inter-diffusion between Ag and Al. As the thermal shock proceeds, the Al2O3 film was fractured, achieving direct contact between metal Al and Ag. Diffusion thus takes place. For the sintered Ag5Al joint, the shear strength was 17.3 MPa after 1000 cycles, which is 1.57 times that of pure sintered Ag joint. These results indicate the successful development of low-cost, high-reliability die attachment materials for use in harsh thermal shock environments.