Physics-based compact models of GaN HEMTs for high power RF applications: A review (Invited Paper)

被引:0
作者
Mao, Shuman [1 ]
Su, Xiang [1 ]
Wu, Qingzhi [1 ]
Wang, Yan [2 ,3 ]
Duan, Xiangyang [2 ,3 ]
Tian, Shen [2 ,3 ]
Li, Xuehuan [2 ,3 ]
Xu, Yuehang [1 ]
机构
[1] Univ Elect Sci & Technol China, Yangtze Delta Reg Inst, Huzhou, Peoples R China
[2] ZTE Corp, Dept RCH Syst, Shenzhen, Peoples R China
[3] ZTE Corp, State Key Lab Mobile Network & Mobile Multimedia, Shenzhen, Peoples R China
基金
中国国家自然科学基金;
关键词
core model; GaN HEMTs; physics-based compact models; real-device effects; LARGE-SIGNAL MODEL; ALGAN/GAN HEMTS; CURRENT COLLAPSE; ANALYTIC MODEL; CIRCUIT MODEL; DEVICES; SIMULATION; STATE; RESISTANCES; TRANSISTORS;
D O I
10.1002/jnm.3276
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The compact model plays a pivotal role as a critical link between device fabrication and circuit design. While conventional compact model theories and techniques are generally mature, the intricate physical mechanisms of gallium nitride (GaN) high-electron mobility transistors (HEMTs) pose challenges due to their strong non-linearity in high-power radio frequency (RF) applications. This complexity hinders achieving the required precision for applications using traditional modeling methods. Therefore, the development of physics-based compact modeling techniques becomes crucial for a deeper understanding of the intricate features of GaN HEMTs. This paper explores the advancements and the current state-of-the-art in physics-based compact models. The comprehensive review covers both intrinsic core models and real-device effects models. Core models are presented with a focus on fundamental concepts, development overviews, and applications. Additionally, the real-device effects models are introduced, encompassing advanced characterization techniques and modeling methodologies. Furthermore, the paper outlines future trends in physics-based compact modeling, providing valuable insights for individuals engaged in transistor compact modeling work.
引用
收藏
页数:22
相关论文
共 117 条
  • [91] EFFECTS OF FIXED BULK CHARGE ON CHARACTERISTICS OF METAL-OXIDE-SEMICONDUCTOR TRANSISTORS
    SAH, CT
    PAO, HC
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1966, ED13 (04) : 393 - +
  • [92] High-Temperature HEMT Mode
    Sahebghalam, Nika
    Shalchian, Majid
    Chalechale, Amirali
    Jazaeri, Farzan
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (09) : 4821 - 4827
  • [93] Modeling of Wide-Bandgap Power Semiconductor Devices-Part II
    Santi, Enrico
    Peng, Kang
    Mantooth, Homer Alan
    Hudgins, Jerry L.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (02) : 434 - 442
  • [94] Sharma K, 2015, IEEE C ELEC DEVICES, P499, DOI 10.1109/EDSSC.2015.7285160
  • [95] STATISTICS OF THE RECOMBINATIONS OF HOLES AND ELECTRONS
    SHOCKLEY, W
    READ, WT
    [J]. PHYSICAL REVIEW, 1952, 87 (05): : 835 - 842
  • [96] KAPITZA CONDUCTANCE AND HEAT-FLOW BETWEEN SOLIDS AT TEMPERATURES FROM 50 TO 300 K
    STONER, RJ
    MARIS, HJ
    [J]. PHYSICAL REVIEW B, 1993, 48 (22) : 16373 - 16387
  • [97] Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications
    Sun, Huarui
    Simon, Roland B.
    Pomeroy, James W.
    Francis, Daniel
    Faili, Firooz
    Twitchen, Daniel J.
    Kuball, Martin
    [J]. APPLIED PHYSICS LETTERS, 2015, 106 (11)
  • [98] Nonlinear statistical modeling and yield estimation technique for use in Monte Carlo simulations
    Swidzinski, JF
    Chang, K
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2000, 48 (12) : 2316 - 2324
  • [99] A Comprehensive Compact Model for GaN HEMTs, Including Quasi-Steady-State and Transient Trap-Charge Effects
    Syamal, Binit
    Zhou, Xing
    Ben Chiah, Siau
    Jesudas, Anand M.
    Arulkumaran, Subramaniam
    Ng, Geok Ing
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (04) : 1478 - 1485
  • [100] Tang X., 2023, IEEE Trans Electron Devices, P1