Temperature dependence of the low-frequency noise in AlGaN/GaN fin field effect transistors

被引:0
作者
Liu, T. K. [1 ]
Lee, H. [2 ]
Luo, X. Y. [1 ]
Zhang, E. X. [3 ]
Schrimpf, R. D. [1 ]
Rajan, S. [2 ]
Fleetwood, D. M. [1 ]
机构
[1] Vanderbilt Univ, Dept Elect & Comp Engn, Nashville, TN 37235 USA
[2] Ohio State Univ, Dept Elect & Comp Engn, Columbus, OH 43210 USA
[3] Univ Cent Florida, Dept Elect & Comp Engn, Orlando, FL 32816 USA
关键词
1/F NOISE; DEFECTS; GAN; HEMTS; FLUCTUATIONS; DEGRADATION; PERFORMANCE; VOLTAGE; STRESS;
D O I
10.1063/5.0230997
中图分类号
O59 [应用物理学];
学科分类号
摘要
Low-frequency (LF) noise measurements are compared for Schottky-gate AlGaN/GaN heterostructure planar and fin field-effect transistors (FinFETs) as functions of gate voltage and measuring temperature. The noise of each device type is consistent with a carrier number fluctuation model. Similar effective defect-energy Eo distributions are derived for each of the two device architectures from measurements of excess drain-voltage noise-power spectral density vs temperature from 80 to 380 K. Defect- and/or impurity-related peaks are observed in the inferred energy distributions for E-o < 0.2 eV, E-o approximate to 0.45 eV, and E-o > 0.6 eV. Significant contributions to the LF noise are inferred for nitrogen vacancies and O-N and Fe-Ga impurity complexes. Ga dangling bonds at fin interfaces with gate metal are likely candidates for enhanced noise observed in FinFETs, relative to planar devices. Reducing the concentrations of these defects and impurity complexes should reduce the LF noise and enhance the performance, reliability, and radiation tolerance of GaN-based high electron mobility transistors. (c) 2024 Author(s).
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页数:10
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