Wettability of Ceramic Substrates by Silver Based Alloys

被引:0
作者
Weltsch, Z. [1 ]
Lovas, A. [1 ]
机构
[1] Budapest Univ Technol & Econ, Dept Automobiles & Vehicle Mfg, H-1111 Budapest, Hungary
基金
匈牙利科学研究基金会;
关键词
LEAD-FREE SOLDERS; GRAPHITE; SURFACES;
D O I
暂无
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The temperature dependence of wettability (wetting angle, Theta(T)) for Ag-based melts on graphite and Al2O3 substrates is compared. Typical alloying effects are found, as the Ag host metal is gradually replaced by various metallic elements. The essence of alloying lies in the change of the electron/atom (e/a) ratio. This ratio is also manifested in the shift of wetting angles on the same substrate. The effect is also supported by the calculations based on the rigid band model, and is also in qualitative agreement with the Hume-Rothery rules. Nevertheless, the effects are partially smeared by other (metallurgical) factors, like the interaction between the oxygen-alloying elements and by the graphite substrate-oxygen interaction. In contrast, such effects are not pronounced in the case of Al2O3 substrates. As a consequence, Theta(T) exhibits an opposite trend in the case of two substrates. Crossovers of the Theta(T) curves were often found. The positions of crossovers depend on the chemical character and concentration of solute atoms. Segregation and epitaxial texture formation after solidification were also observed in certain alloy drops, especially in high concentration range. This phenomenon is not yet explained in every detail.
引用
收藏
页码:78 / 86
页数:9
相关论文
共 39 条
  • [1] Lead-free solders in microelectronics
    Abtew, M
    Selvaduray, G
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) : 95 - 141
  • [2] Allen B.C., 1972, LIQUID METALS CHEM P, P165
  • [3] [Anonymous], 1997, STRUCTURE PROPERTIES, VIV
  • [4] Cahn R. W., 1983, PHYS METALLURGY
  • [5] The technical, social, and legal outlook for lead-free solders
    Casey, P
    Pecht, M
    [J]. PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 15 - 24
  • [6] Ering M., J MAT SCI MAT ELECT, V16
  • [7] Fa C.-C., 2011, J TAIWAN INST CHEM E, V42, P350
  • [8] Fliigge S., 1956, ENCY PHYS, VXIX, P208
  • [9] Fulton J. P., 1993, REV PROGR QUANTITATI, P1611
  • [10] Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
    Garcia, Leonardo R.
    Osorio, Wislei R.
    Peixoto, Leandro C.
    Garcia, Amauri
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (11) : 2405 - 2414