A SiC MOSFET propulsion inverter design with power redundancy, considering unwanted events, for electrical aircrafts

被引:0
|
作者
Kim, Simon [1 ]
Lee, Donghyun [2 ]
Mier, Ainhoa Puyadena [3 ]
Kim, Myeonghyo [4 ]
Kwak, Byunggil [4 ]
机构
[1] Infineon Technol Korea, Ind Inf Consum Comp & Comm, Seoul, South Korea
[2] Hanwha Syst, Power Control Team, Yongin, South Korea
[3] Infineon Technol Germany, Green Ind Power, Tech Marketing, Warstein, Germany
[4] Hanwha Aerosp Co Ltd, E Propuls Biz Grp, Seongnam, South Korea
来源
2024 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO, ITEC 2024 | 2024年
关键词
Distributed electric propulsion (DEP); SiC MOSFET; Virtual flight profile; Power redundancy;
D O I
10.1109/ITEC60657.2024.10599039
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper discusses a distributed electric propulsion (DEP) system for virtual aviation systems. The DEP system includes six propulsion inverters with SiC MOSFET modules. Through three different virtual flight profiles normal planed one, another with changed trajectory, and the other with changed trajectory and failure mode power and current sharing between these modules was investigated. Measurement-based loss simulations and thermal simulations, with defined cooling conditions, were performed to test power redundancy and loss in each propulsion inverter for all the three virtual profiles.
引用
收藏
页数:6
相关论文
共 50 条
  • [41] Design and Testing of 6 kV H-bridge Power Electronics Building Block Based on 10 kV SiC MOSFET Module
    Wang, Jun
    Mocevic, Slavko
    Hu, Jiewen
    Xu, Yue
    DiMarino, Christina
    Cvetkovic, Igor
    Burgos, Rolando
    Boroyevich, Dushan
    2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA), 2018, : 3985 - 3992
  • [42] Design and Testing of 1 kV H-bridge Power Electronics Building Block Based on 1.7 kV SiC MOSFET Module
    Wang, Jun
    Burgos, Rolando
    Boroyevich, Dushan
    Liu, Zeng
    2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA), 2018, : 3749 - 3756
  • [43] Design of a High-power Density Power Module with Large-area (10 mm x 10 mm) SiC MOSFETs for Traction Inverter Application
    Jiang, Yi
    Che, Liming
    Lei, Guangyin
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [44] Design and Test of a Planarized High Power Density 100 kW SiC Traction Inverter with 1kV DC-Link
    Yang, Li
    Luo, Yukun
    Moorthy, Radha Sree Krishna
    Rahman, Dhrubo
    Yu, Wensong
    Husain, Iqbal
    2018 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2018, : 3864 - 3871
  • [45] Design of a High-Bandwidth Rogowski Current Sensor for Gate-Drive Shortcircuit Protection of 1.7 kV SiC MOSFET Power Modules
    Wang, Jun
    Shen, Zhiyu
    Burgos, Rolando
    Boroyevich, Dushan
    WIPDA 2015 3RD IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS, 2015, : 104 - 107
  • [46] Genetic Algorithm-Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
    Fan, Jiajie
    Qian, Yichen
    Chen, Wei
    Jiang, Jing
    Tang, Zhuorui
    Fan, Xuejun
    Zhang, Guoqi
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 260 - 265
  • [47] Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
    Chen, Wei
    Yan, Xuyang
    Ibrahim, Mesfin S.
    Meda, Abdulmelik H.
    Fan, Xuejun
    Zhang, Guoqi
    Fan, Jiajie
    2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 2007 - 2011
  • [48] Hardware Design and Demonstration of a 100kW, 99% Efficiency Dual Active Half Bridge Converter Based on 1700V SiC Power MOSFET
    Xu, We
    Guo, Zhicheng
    Tayebi, S. Milad
    Rajendran, Sanjay
    Sun, Ao
    Yu, Ru Yang
    Huang, Alex Q.
    2020 THIRTY-FIFTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2020), 2020, : 1367 - 1373
  • [49] Using Multi Time-Scale Electro-thermal Simulation Approach to Evaluate SiC-MOSFET Power Converter in Virtual Prototyping Design Tool
    Li, Ke
    Evans, Paul
    Johnson, Mark
    2017 IEEE 18TH WORKSHOP ON CONTROL AND MODELING FOR POWER ELECTRONICS (COMPEL), 2017,
  • [50] Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network
    Qian, Yichen
    Hou, Fengze
    Fan, Jiajie
    Lv, Quanya
    Fan, Xuejun
    Zhang, Guoqi
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 68 (07) : 3460 - 3467