Numerical simulation of heat transfer during spark plasma sintering of porous SiC

The strong covalent bonding of SiC makes it difficult to be fully sintered using conventional sintering techniques. Therefore, electrical current-assisted sintering techniques such as spark plasma sintering are needed to sinter SiC. The finite numerical simulations have been generally used to predict and guide sintering processes of ceramics (i. e.TiC,AlO3). In this work, the numerical simulations of the temperature distribution, electrical field and thermal field on the porous SiC cylindrical samples by Comsol were investigated in details. The influence of porosity on the temperature distribution and electrical field distribution of the SiC samples were analyzed. Both the maximum current density (1.19 x 10(7)A/m(2)) and the maximum temperature (2030 degrees C) of the SPS device occurred at the punch/spacer interface. The temperature values at the centre of the samples were proportional to the porosity, and the temperatures at the center of the samples increased from similar to 1960 degrees C to similar to 2010 degrees C at t = 2000s, with the porosity increasing from 1% to 60%. The uniformity of the temperature distribution deteriorated as the porosity increases, and the temperature gradients between the center and edge of the samples with the porosity of 1% and 60%, were similar to 80 degrees C and similar to 130 degrees C at t = 2000s, respectively.