Electrothermal Averaged Model of a Half-Bridge DC-DC Converter Containing a Power Module

被引：0

作者：

Gorecki, Krzysztof ^{[1
]}

Gorecki, Pawel ^{[1
]}

机构：

[1] Gdynia Maritime Univ, Fac Elect Engn, Morska 81-87, PL-81225 Gdynia, Poland

来源：

ELECTRONICS | 2024年 / 13卷 / 18期

关键词：

half-bridge DC-DC converters; averaged models; electrothermal models; SPICE; power modules; mutual thermal couplings; modeling; THERMAL-MODEL;

D O I：

10.3390/electronics13183662

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This article proposes an electrothermal averaged model of a half-bridge DC-DC converter containing a power module. This kind of model enables the computation of characteristics of DC-DC converters using DC analysis. The form of the elaborated model is presented. Both the electrical and thermal properties of the analyzed DC-DC converter are included in this model. This is the first averaged electrothermal model of a DC-DC converter which makes it possible to compute the junction temperature of all the semiconductor devices and magnetic components. The accuracy of the model was experimentally verified in a wide range of switching frequencies and output currents. Particularly, the influence of mutual thermal couplings between the transistors contained in the considered module on the characteristics of the converter and the junction temperature of the transistors is analyzed.

引用

页数：14