Hot Deformation Behavior and Microstructure Evolution of a Graphene/Copper Composite

被引：0
作者：
Li, Tiejun [1 ]
Lu, Ruiyu [1 ]
Cao, Yuankui [1 ]
Liu, Bicheng [1 ]
Fu, Ao [1 ]
Liu, Bin [1 ]
机构：
[1] Cent South Univ, State Key Lab Powder Met, Changsha 410083, Peoples R China
来源：
MATERIALS | 2024年 / 17卷 / 16期
基金：
中国博士后科学基金;
关键词：
graphene/copper composite; hot deformation behavior; dynamic recrystallization; microstructure; PROCESSING MAPS; FLOW;
D O I：
10.3390/ma17164010
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Graphene/copper composites are promising in electronic and energy fields due to their superior conductivity, but microstructure control during thermal mechanical processing (TMP) remains a crucial issue for the manufacturing of high-performance graphene/copper composites. In this study, the hot deformation behavior of graphene/copper composites was investigated by isothermal compression tests at deformation temperatures of 700 similar to 850 degrees C and strain rates of 0.01 similar to 10 s(-1), and a constitutive equation based on the Arrhenius model and hot processing map was established. Results demonstrate that the deformation mechanism of the graphene/copper composites mainly involves dynamic recrystallization (DRX), and such DRX-mediated deformation behavior can be accurately described by the established Arrhenius model. In addition, it was found that the strain rate has a stronger impact on the DRX grain size than the deformation temperature. The optimum deformation temperature and strain rate were determined to be 800 degrees C and 1 s(-1), respectively, with which a uniform microstructure with fine grains can be obtained.
引用
收藏
页数：12
相关论文
共 36 条
[1]   Adlayer-free large-area single-crystal CVD graphene growth on copper [J].
Arya, Chaitanya ;
De Silva, K. Kanishka H. ;
Yoshimura, Masamichi .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (24) :21821-21831
[2]   Prediction of thermo-mechanical behavior and microstructural evolution of copper considering initial grain size at elevated temperature [J].
Ashtiani, Hamid Reza Rezaei ;
Shayanpoor, A. A. .
MATERIALS TODAY COMMUNICATIONS, 2021, 28
[3]   EBSD analysis of hot deformation behavior of Cu-Ni-Co-Si-Cr alloy [J].
Ban, YiJie ;
Zhang, Yi ;
Tian, Baohong ;
Song, KeXing ;
Zhou, Meng ;
Zhang, Xiaohui ;
Jia, Yanlin ;
Li, Xu ;
Geng, Yongfeng ;
Liu, Yong ;
Volinsky, Alex A. .
MATERIALS CHARACTERIZATION, 2020, 169
[4]   Hot workability and models for flow stress of NIMONIC 115 Ni-base superalloy [J].
Bruni, C ;
Forcellese, A ;
Gabrielli, F .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2002, 125 :242-247
[5]   Aligning graphene in bulk copper: Nacre-inspired nanolaminated architecture coupled with in-situ processing for enhanced mechanical properties and high electrical conductivity [J].
Cao, Mu ;
Xiong, Ding-Bang ;
Tan, Zhanqiu ;
Ji, Gang ;
Amin-Ahmadi, Behnam ;
Guo, Qiang ;
Fan, Genlian ;
Guo, Cuiping ;
Li, Zhiqiang ;
Zhang, Di .
CARBON, 2017, 117 :65-74
[6]   Raman spectroscopy as a versatile tool for studying the properties of graphene [J].
Ferrari, Andrea C. ;
Basko, Denis M. .
NATURE NANOTECHNOLOGY, 2013, 8 (04) :235-246
[7]   A novel cobalt-free oxide dispersion strengthened medium-entropy alloy with outstanding mechanical properties and irradiation resistance [J].
Fu, Ao ;
Liu, Bin ;
Liu, Bo ;
Cao, Yuankui ;
Wang, Jian ;
Liao, Tao ;
Li, Jia ;
Fang, Qihong ;
Liaw, Peter K. ;
Liu, Yong .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2023, 152 :190-200
[8]   The rise of graphene [J].
Geim, A. K. ;
Novoselov, K. S. .
NATURE MATERIALS, 2007, 6 (03) :183-191
[9]   Unprecedented electrical performance of friction-extruded copper-graphene composites [J].
Gwalani, Bharat ;
Li, Xiao ;
Nittala, Aditya ;
Choi, Woongjo ;
Reza-E-Rabby, Md. ;
Atehortua, Julian Escobar ;
Bhattacharjee, Arun ;
Pole, Mayur ;
Silverstein, Joshua ;
Song, Miao ;
Kappagantula, Keerti .
MATERIALS & DESIGN, 2024, 237
[10]   The Role of Surface Oxygen in the Growth of Large Single-Crystal Graphene on Copper [J].
Hao, Yufeng ;
Bharathi, M. S. ;
Wang, Lei ;
Liu, Yuanyue ;
Chen, Hua ;
Nie, Shu ;
Wang, Xiaohan ;
Chou, Harry ;
Tan, Cheng ;
Fallahazad, Babak ;
Ramanarayan, H. ;
Magnuson, Carl W. ;
Tutuc, Emanuel ;
Yakobson, Boris I. ;
McCarty, Kevin F. ;
Zhang, Yong-Wei ;
Kim, Philip ;
Hone, James ;
Colombo, Luigi ;
Ruoff, Rodney S. .
SCIENCE, 2013, 342 (6159) :720-723
1234