The dichotomous role of oxygen in the ohmic contact formation on p-type GaN grown by MBE and MOCVD

被引:0
作者
Hua, Haowen [1 ,2 ]
Zhang, Peng [3 ]
Gong, Yi [2 ]
Gu, Ying [2 ]
Jin, Shan [2 ]
Yang, Wenxian [2 ]
Zhu, Jianjun [2 ]
Lu, Shulong [2 ]
机构
[1] Univ Sci & Technol China, Sch Nanotech & Nanob, Hefei 230026, Anhui, Peoples R China
[2] Chinese Acad Sci, Suzhou Inst Nanotech & Nanob, Key Lab Semicond Display Mat & Chips, Suzhou 215123, Jiangsu, Peoples R China
[3] Univ Sci & Technol China, Sch Microelect, Hefei 230026, Anhui, Peoples R China
基金
中国国家自然科学基金;
关键词
Ohmic contact; P-type GaN; MBE; Annealing ambient; Surface analysis; MG-DOPED GAN; LASER-DIODES; NI/AU;
D O I
10.1016/j.surfin.2024.104974
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Molecular beam epitaxy (MBE) is often considered as an ideal equipment for growing low-resistance p-type GaN (p-GaN). However, the Ohmic contact formation mechanism of p-GaN grown by MBE is still unclear. In this work, MOCVD and MBE-grown p-GaN were prepared for contrastive analysis. We reported for the first time the different variation tendency in their electrical properties after annealing in the same ambient. Surface analyzing instruments were used to investigate the interfacial properties of p-GaN. Experimental results revealed that the oxygen in the annealing ambient had a negative effect on the Ohmic contact formation of MBE p-GaN, and the physical mechanism underlying it was figured out. It is proved that the annealing conditions for preparing Ohmic contacts on MOCVD p-GaN is not suitable for that on MBE p-GaN. To further reduce the effect of oxygen, an optimized Ohmic contact scheme for MBE p-GaN based on the Ni-Pd contact layer was proposed, which successfully reduced the specific contact resistivity (rho(c)) by two orders, to 8.6 x 10(-5) Omega center dot cm(2), compared with the conventional Pd/Pt/Au system. This research provides valuable guidance for device fabrication based on GaN grown by MBE and lays an essential foundation for preparing optoelectronic devices.
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页数:9
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