Effect of intermetallic compounds on the mechanical properties of Cu/Al clad sheets with an SS304 interlayer

被引:1
作者
Gao, Haitao [1 ]
Li, Jing [1 ]
Song, Lingling [1 ]
Peng, Xinyao [1 ]
Kong, Charlie [2 ]
Yu, Hailiang [1 ]
机构
[1] Cent South Univ, Light Alloy Res Inst, State Key Lab Precis Mfg Extreme Serv Performance, Changsha 410083, Peoples R China
[2] Univ New South Wales, Electron Microscope Unit, Sydney, NSW 2052, Australia
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2024年 / 915卷
基金
中国国家自然科学基金;
关键词
Cu/Al clad sheet; SS304; interlayer; Roll bonding; Annealing temperature; Bonding mechanism; HEAT-TREATMENT; MICROSTRUCTURE EVOLUTION; INTERFACIAL STRUCTURE; BONDING MECHANISM; LAYER; COMPOSITE; STRENGTH; BEHAVIOR; DEFORMATION; TEMPERATURE;
D O I
10.1016/j.msea.2024.147286
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Annealing treatments were conducted on Cu/Al clad sheets incorporating a 304 stainless steel (SS304) interlayer to investigate the impact of intermetallic compounds (IMCs) on the mechanical properties of these clad sheets with an interfacial layer. Additionally, the mechanisms of interfacial strengthening and crack propagation behavior were examined. It was found that the best overall performance was achieved for samples annealed at 200 degrees C, showing tensile strength, fracture elongation, and peeling strength values of 219 MPa, 7.19 %, and 19.6 N/mm, respectively. For the rolled clad sheet, cracks typically initiated at the edges of the SS304 fragments, accompanied by minor residual holes and stress concentrations. Post-annealing, the Cu and Al layers underwent varying degrees of recovery and recrystallization, and element diffusion increased, leading to improvements in elongation and interfacial bonding strength of the clad sheets. As the thickness of the IMCs grew, the interfacial crack propagation path shifted to the Al2Cu/AlCu interface within the IMC layer, significantly reducing the bonding strength.
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页数:18
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