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- [15] DIRECT LIQUID COOLING FOR IGBT POWER MODULE 2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 41 - 44
- [18] Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 14 (05): : 795 - 809