Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics

被引：0
作者：
Mazumder, Sudip K. [1 ]
Shen, Zheng John [2 ]
Wang, Shuo [3 ]
机构：
[1] Univ Illinois, Chicago, IL 60607 USA
[2] Simon Fraser Univ, Sch Mechatron Syst Engn, Burnaby, BC V5A 1S6, Canada
[3] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
来源：
IEEE TRANSACTIONS ON POWER ELECTRONICS | 2024年 / 39卷 / 11期
关键词：
Special issues and sections; Ultra wideband technology; Photonic band gap; Packaging; Control systems; Power semiconductor devices; Electromagnetic interference;
D O I：
10.1109/TPEL.2024.3451848
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：14304 / 14306
页数：3
相关论文
共 33 条
  • [21] 3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules
    Ke, Haotao
    Mehrotra, Utkarsh
    Hopkins, Douglas C.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2021, 36 (11) : 13057 - 13066
  • [22] Characterization Circuit, Gate Driver and Fixture for Wide-Bandgap Power Semiconductor Device Testing
    Saadeh, Osama
    Al-Hmoud, Ahmad
    Dalala, Zakariya
    [J]. ELECTRONICS, 2020, 9 (05)
  • [23] A Review on Recent Characterization Effort of CM EMI in Power Electronics System with Emerging Wide Band Gap Switch
    Amin, Ashik
    Choi, Seungdeog
    [J]. 2019 IEEE ELECTRIC SHIP TECHNOLOGIES SYMPOSIUM (ESTS 2019): EMERGING TECHNOLOGIES FOR FUTURE ELECTRIC SHIPS, 2019, : 241 - 248
  • [24] Guest Editorial of the Special section on Emerging Technologies and Applications of Consumer Electronics for Healthy and Sustainable Life
    Ding, Yuemin
    Pang, Zhibo
    Yang, Po
    Yu, Kan
    Pan, Fei
    [J]. IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 2024, 70 (01) : 2378 - 2381
  • [25] Guest Editorial Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation
    Wang, Huai
    Hu, Jingxin
    De Doncker, Rik W.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (12) : 15565 - 15566
  • [26] Guest Editorial Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation
    Wang, Huai
    Hu, Jingxin
    de Doncker, Rik W.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (11) : 14216 - 14217
  • [27] Common-Mode EMI Unterminated Behavioral Model of Wide-Bandgap-Based Power Converters Operating at High Switching Frequency
    Sun, Bingyao
    Burgos, Rolando
    Boroyevich, Dushan
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2019, 7 (04) : 2561 - 2570
  • [28] Guest Editorial: Special Section on Invited Papers From the 2022 IEEE Conference on Control Technology and Applications (CCTA 2022)
    Serrani, Andrea
    [J]. IEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY, 2024, 32 (05) : 1538 - 1539
  • [29] Foreword Special Section on "Evolving Trends in Electrical Modeling, Validation, and Signal and Power Integrity Analysis in Electronic Packaging and Systems"
    Kuehler, Thomas
    Peng, Zhen
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (10): : 1531 - 1532
  • [30] Electro-Thermal Device-Package Co-Design for Ultra-Wide Bandgap Gallium Oxide Power Devices
    Albano, Benjamin
    Wang, Boyan
    Zhang, Yuhao
    DiMarino, Christina
    [J]. 2022 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2022,
1234