Vicinal (111) surfaces at Si solid-liquid interface during unidirectional solidification

被引:1
|
作者
Mishra, Shashank Shekhar [1 ]
Chuang, Lu-Chung [1 ]
Nozawa, Jun [1 ]
Maeda, Kensaku [1 ]
Morito, Haruhiko [1 ]
Fujiwara, Kozo [1 ]
Duffar, Thierry [1 ,2 ]
机构
[1] Tohoku Univ, Inst Mat Res, Katahira 2-1-1,Aoba Ku, Sendai 9808577, Japan
[2] Univ Grenoble Alpes, Grenoble INP, CNRS, SIMAP, Grenoble, France
关键词
Silicon; Directional solidification; Facets; Interface dynamics; Vicinal surface; GRAIN-BOUNDARY GROOVES; DIRECTIONAL SOLIDIFICATION; POLYCRYSTALLINE SILICON; ELECTRICAL-ACTIVITY; CRYSTAL-GROWTH; MELT;
D O I
10.1016/j.scriptamat.2024.116116
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The solid-liquid interfaces of silicon grains have been observed by an in-situ system. Two silicon seeds having different crystallographic orientations (as < 100 >, < 110 >, and < 111 >) along the growth direction were placed side by side in a silica crucible for the direct comparison of interface behavior during the melt-growth process. Experimental evidence proved the existence of flat {111} surfaces at different grain orientations during crystallization. The difference in the interface positions of the two grains was used to calculate the undercooling of the {111} surfaces. The growth rate-undercooling relationship was linear in all experiments, showing that the observed flat surfaces were planes vicinal to {111} facets, growing through a step flow mode. The terrace length was constant but different from one experiment to another. Therefore, this work indicates that it is crucial to consider the vicinal surface kinetics in the analysis of Si facet planes and grooves during the melt-growth process.
引用
收藏
页数:5
相关论文
共 50 条
  • [1] LATERAL SOLUTE SEGREGATION DURING UNIDIRECTIONAL SOLIDIFICATION OF A BINARY ALLOY WITH A CURVED SOLID-LIQUID INTERFACE
    CORIELL, SR
    SEKERKA, RF
    JOURNAL OF CRYSTAL GROWTH, 1979, 46 (04) : 479 - 482
  • [2] INSTABILITY OF A SMOOTH SOLID-LIQUID INTERFACE DURING SOLIDIFICATION
    PFANN, WG
    TILLER, WA
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1956, 206 (05): : 617 - 618
  • [3] INSTABILITY OF A SMOOTH SOLID-LIQUID INTERFACE DURING SOLIDIFICATION
    WALTON, D
    TILLER, WA
    RUTTER, JW
    WINEGARD, WC
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1955, 203 (09): : 1023 - 1026
  • [4] Influence of solidification rate on solid-liquid interface in unidirectional solidification microstructure of austenitic stainless steel
    Liu, Xu-Feng
    Li, Qiu-Shu
    Du, Wei-Dong
    Li, Ren-Xing
    Zhai, Qi-Jie
    Cailiao Kexue yu Gongyi/Material Science and Technology, 2009, 17 (01): : 110 - 112
  • [5] INTERFACIAL STABILITY OF PLANAR SOLID-LIQUID INTERFACE DURING UNIDIRECTIONAL SOLIDIFICATION OF AL-ZN ALLOY
    SATO, T
    ITO, K
    OHIRA, G
    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1980, 21 (07): : 441 - 448
  • [6] Distribution of solute at solid-liquid interface during solidification of melt
    Fukui, K
    Maeda, K
    JOURNAL OF CHEMICAL PHYSICS, 1998, 109 (17): : 7468 - 7473
  • [7] Studies of solid-liquid interface behaviors during solidification process
    Kim, J.-H.
    TMS Annual Meeting, 1992,
  • [8] Influence of solidification rate on solid-liquid interface of Si-Ta alloy
    Cui, C.-J. (cuichunjuan@xauat.edu.cn), 1600, Beijing Institute of Aeronautical Materials (BIAM)
  • [9] THERMAL STUDY OF SOLID-LIQUID INTERFACE RATE DURING BRIDGMAN SOLIDIFICATION
    RIQUET, JP
    DURAND, F
    JOURNAL OF CRYSTAL GROWTH, 1976, 33 (02) : 303 - 310
  • [10] Effects of mould filling on evolution of the solid-liquid interface during solidification
    Pathak, Nitin
    Kumar, Arvind
    Yadav, Anil
    Dutta, Pradip
    APPLIED THERMAL ENGINEERING, 2009, 29 (17-18) : 3669 - 3678