Adhesive properties of deposited Cu films on colorless polyimide using high power impulse magnetron sputtering system

被引：0
|
作者：
Tsai, Yuan-Nan [1 ]
Chen, Hsin-Yo [2 ]
Tseng, I-Hsiang [3 ]
Lee, Jyh-Wei [4 ,5 ,6 ,7 ]
Tsai, Mei-Hui [1 ,2 ]
Li, Ming-Syuan [1 ]
Wang, Chih-Hsing [8 ]
Gee, Chuen-Ming [8 ]
Chen, Tzu-Ling [2 ]
Tsai, Pin-Chen [2 ]
机构：
[1] Natl Chin Yi Univ Technol, Inst Precis Mfg, Taichung 411030, Taiwan
[2] Natl Chin Yi Univ Technol, Dept Chem & Mat Engn, Taichung 411030, Taiwan
[3] Feng Chia Univ, Dept Chem Engn, Taichung 407102, Taiwan
[4] Ming Chi Univ Technol, Dept Mat Engn, New Taipei 243303, Taiwan
[5] Ming Chi Univ Technol, Ctr Plasma & Thin Film Technol, New Taipei 243303, Taiwan
[6] Chang Gung Univ, Coll Engn, Taoyuan 333323, Taiwan
[7] Natl Tsing Hua Univ, High Entropy Mat Ctr, Hsinchu 300044, Taiwan
[8] Natl Chung Shan Inst Sci & Technol, Mat & Electroopt Res Div, Taoyuan 325204, Taiwan
来源：
SURFACE & COATINGS TECHNOLOGY | 2024年 / 484卷
关键词：
Duty cycle; HiPIMS; Adhesion; Mechanical interlocking; TRANSPARENT POLYIMIDE; STRENGTH;
D O I：
10.1016/j.surfcoat.2024.130710
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This study explores the deposition of copper (Cu) films onto colorless polyimides (PIs) using the High Power Impulse Magnetron Sputtering (HiPIMS) technique. The impact of varying operating duty cycles and frequencies on sheet resistance, the deposition rate of Cu films, and the adhesion strength between Cu and PI is examined. Adjusting the HiPIMS parameters aims to achieve superior film quality with reduced sheet resistance. Furthermore, post-thermal treatment significantly improves the adhesion of the Cu layer to the PI substrate due to the mechanical interlocking mechanism created by the surface roughness of the PI and the chemical bonding between the two components.
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页数：11
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