Boronizing of Monel K500 alloy: Microstructural characterization and modeling of boron diffusion

In this study, the thermochemical treatments were carried out using the powder-pack boronizing method at temperatures ranging from 1123 K to 1223 K for durations of 2 to 6 h, with the aim of improving the surface properties of Monel K500 alloy. Microstructural investigation of the boride layers, conducted using optical microscopy (OM) and scanning electron microscopy (SEM), revealed a needle-like layer structure with high porosity homogeneously distributed on the surface. The results of XRD analysis showed that the boride layer contained different nickel borides (Ni2B, Ni3B, Ni4B3 and NiB12), iron borides (Fe2B and Fe3B) and complex borides (Fe4.5Ni18.5B6 and Fe3Ni3B). The presence and amount of elements in the boride layer were determined by EDS analysis. This study focused mainly on diffusion kinetics studies of boronized Monel K500 alloy. Growth kinetics of the boride layer were investigated using three different approaches such as parabolic growth model, regression model and mean diffusion coefficient (MDC) model. Boron activation energy values were calculated and found to be quite similar, at 266.14 kJ mol-1 and 266.17 kJ mol-1 using the MDC model and parabolic growth model, respectively. These values were compared with similar results reported in the literature.