共 68 条
[4]
Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools
[J].
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3,
2008,
:527-532
[5]
Bendsoe M, 2004, Topology Optimization: Theory, Methods, and Applications, V2nd, DOI [10.1007/978-3-662-05086-6, DOI 10.1007/978-3-662-05086-6]
[9]
Dede E., 2009, P COMSOL C 2009
[10]
Errico RM, 1997, B AM METEOROL SOC, V78, P2577, DOI 10.1175/1520-0477(1997)078<2577:WIAAM>2.0.CO