A Micro-hotplate for MEMS Gas Sensor Wafer Level Packaging

In this work, we designed a micro-hotplate for MEMS gas sensor wafer level packaging. It changes the current package structure. we built a thermal- electromechanical-mechanical simulation model. Based on this model, we compared Oxide-Nitride-Oxide (ONO) supporting layers and finally chose ONO due to the balanced thermal and mechanical performances. The micro-hotplate was fabricated by MEMS process. After testing, the performance of micro- hotplate samples meets the design requirements. The optimized micro-hotplate with wafer level packaging not only has the advantages of low power consumption, but also realizes the high-density integration of multiple independent temperature- controlled micro hotplates, which is expected to be widely used in the future, especially for Micro-electromechanical Systems (MEMS) gas sensor.