Highly Efficient Spin Current Transport Properties in Spintronic Devices Based on Topological Insulator

被引:0
作者
Yun, Jijun [1 ,2 ]
Xi, Li [3 ,4 ]
机构
[1] Northwestern Polytech Univ, Shaanxi Key Lab Condensed Matter Struct & Properti, Xian 710072, Peoples R China
[2] Northwestern Polytech Univ, Sch Phys Sci & Technol, MOE Key Lab Mat Phys & Chem Extraordinary Condit, Xian 710072, Peoples R China
[3] Lanzhou Univ, Key Lab Magnetism & Magnet Mat, Minist Educ, Lanzhou 730000, Peoples R China
[4] Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China
基金
中国国家自然科学基金;
关键词
spin Hall magnetoresistance; spin transport; spin-orbit torque; spin-to-charge conversion; topological insulators; RASHBA-EDELSTEIN MAGNETORESISTANCE; SINGLE DIRAC CONE; ORBIT TORQUE; SURFACE-STATES; HALL; BI2SE3; BI2TE3;
D O I
10.1002/qute.202400041
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Recently, topological insulators (TIs) have regained extensive attention in spintronics due to their potential applications in new-generation spintronic devices, following the discovery of the quantum Hall effect and quantum anomalous Hall effect, which introduce the topological concept. In this review, the exotic spin transport phenomena are explored in TIs. The review offers a concise overview of the fundamental principles of TIs, followed by an exploration of diverse fabrication methods for TI materials. Characterization techniques of the topological surface states are also presented. The review delves into the intriguing spin current transport phenomena, focusing on spin-to-charge and charge-to-spin conversions in TI/ferromagnet bilayers, respectively. The review culminates summarizing key insights and project future directions for research on spin transport phenomena in TIs, emphasizing practical implications. Owing to the inherent spin-momentum locking property of surface states, topological insulators (TIs) exhibit an excellent performance on the spin-to-charge interconversion. This review explores advanced spin current transport in TI/ferromagnet bilayers, highlighting their potential in next-generation spintronic devices. These advancements showcase TIs' versatility for spintronics and stress the necessity to integrate them with established manufacturing for practical applications. image
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页数:13
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