NUMERICAL SIMULATION OF THERMAL PERFORMANCE OF COLD PLATES FOR HIGH HEAT FLUX ELECTRONICS COOLING

High heat flow density electronic components need cooling plates with strong heat exchange capacity to maintain temperature balance. To obtain better cooling performance, four different flow channel types of cooling plates are designed, including an S -type channel, Z -type channel, mosaic channel and double-layer channel. The maximum temperature of the cooling plate, outlet temperature and pressure drop under different working conditions and coolant are analyzed by numerical simulation. The simulation results show that the double-layer channel design can effectively enhance the heat transfer effect of the cooling plate and reduce the pressure drop. The maximum temperature of the cooling plate of the double-layer flow channel is 6.88 degrees C lower than that of the Z-type flow channel. Moreover, increasing the inlet flow rate and lowering the coolant inlet temperature can improve the cooling performance of the cold plate, but increasing the inlet flow rate will lead to an increase in the pressure loss of the cold plate. When the coolant of the double-layer channel cooling plate is 20% ethylene glycol-water solution, the cooling performance is better than the other three coolants. Other channel cooling plates perform better with water as the coolant.