Low-Temperature Annealing in O2 to Annihilate the Fixed Charges in 4H-SiC/SiO2 Interface Induced by High-N-Density Nitridation Process

被引:0
作者
Yang, Tianlin [1 ]
Onaya, Takashi [2 ]
Kita, Koji [2 ,3 ]
机构
[1] Univ Tokyo, Dept Mat Engn, Bunkyo, Tokyo 1138656, Japan
[2] Univ Tokyo, Dept Adv Mat Sci, Kashiwa, Chiba 2778561, Japan
[3] Univ Tokyo, Dept Mat Engn, Kashiwa, Chiba 2778561, Japan
关键词
4H-SiC/SiO2 MOS interface; post-nitridation annealing; fixed charge; OXIDATION; MOSFETS;
D O I
10.1109/LED.2024.3400954
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A low-temperature annealing process for 4H-SiC/SiO2 stack in O-2 ambient was found to annihilate the positive fixed charges induced by the interface nitridation process effectively, while preserving the interface N density. The key to design the post-nitridation annealing process in O-2 ambient was proposed as the selection of a relatively low temperature and a sufficiently long duration, which is to selectively trigger the annihilation of fixed charges while suppressing the N-removal from the interface.
引用
收藏
页码:1145 / 1148
页数:4
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