Numerical investigation of droplet impact and heat transfer on hot substrates under an electric field

被引:6
作者
Xu, Haojie [1 ]
Wang, Junfeng [1 ]
Wang, Hai [1 ]
Li, Bin [1 ]
Yu, Kai [1 ]
Yao, Jiang [1 ]
Zhang, Wei [1 ]
Zuo, Lei [1 ]
机构
[1] Jiangsu Univ, Sch Energy & Power Engn, Zhenjiang 212013, Peoples R China
基金
中国国家自然科学基金;
关键词
Droplet; Electric field; Impact dynamics; Heat transfer; Phase; -field; ELECTROHYDRODYNAMICS;
D O I
10.1016/j.ijheatmasstransfer.2024.125721
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this study, the effects of the electric field on the impact dynamics and heat transfer of a single droplet impinging on hot substrates in the film evaporation regime were numerically investigated with phase-field method. According to the simulation results, many fancy impact behaviors of the droplets under a vertical electric field were observed. A strong electric field was found to induce upward pinch-off or even tiny jet phenomena on the hydrophilic substrates. In contrast, the bouncing droplet on hydrophobic substrate would be vertically stretched before leaving the substrates. The maximum spreading ratio of impacting droplets was always inversely proportional to the applied electric field intensity. Correlations of the maximum spreading for the charged condition were proposed by considering the effects of the electric force. In addition, the total heat transfer from hot substrates to the impacting droplet was verified as closely related to the maximum spreading area, spreading time, and instantaneous local heat flux. However, the broken droplets from the induced tiny jet would eventually fall back to disturb the sessile droplet, enhancing the droplet cooling efficiency. The modified heat transfer model of impacting droplets under the effect of an electric field on hydrophilic substrates was established. Finally, the surface charge distribution and electric force loading of the impacting droplets were also discussed. This work delved deep into the underlings of droplet spreading heat transfer under an electric field, and the main findings promised to advance high-efficiency cooling technology.
引用
收藏
页数:15
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